| Allicdata Part #: | ATS-03E-36-C2-R0-ND |
| Manufacturer Part#: |
ATS-03E-36-C2-R0 |
| Price: | $ 5.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X11.43MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03E-36-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.23971 |
| 30 +: | $ 4.94865 |
| 50 +: | $ 4.65759 |
| 100 +: | $ 4.36647 |
| 250 +: | $ 4.07537 |
| 500 +: | $ 3.78427 |
| 1000 +: | $ 3.71150 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical factor for the successful operation of electronic systems. The most effective way to reduce or eliminate thermal problems is to optimize the overall thermal design of the system. This includes selecting an appropriate thermal solution, such as a heat sink, to dissipate the heat generated by components within the system. The ATS-03E-36-C2-R0 is a pick-and-placeable heat sink designed to provide thermally efficient cooling for electronic components.
The ATS-03E-36-C2-R0 heat sink is constructed from a combination of materials including aluminum, copper, and plastic. The combination of these materials provides the ATS-03E-36-C2-R0 with superior thermal efficiency, thermal capacity, and mechanical strength. The heat sink is a standard 36 mm x 36 mm package and is designed to fit on SMT connectors, modules, and boards. The pick-and-placeable design of the ATS-03E-36-C2-R0 allows for quick assembly and offers flexibility when designing a system.
The ATS-03E-36-C2-R0 is commonly used in applications that require high thermal loads, such as power amplifiers, motor controllers, and Peltier cooling units. The ATS-03E-36-C2-R0 is also ideal for applications that require efficient thermal dissipation and maximum thermal capacity, such as in automotive electronics, LED lighting modules, and communication equipment. The combination of materials used in the ATS-03E-36-C2-R0 provides excellent thermal and electrical insulation for a wide range of applications.
The ATS-03E-36-C2-R0 works by dissipating the heat generated by electronic components to the surrounding environment. The heat is removed from the components and transferred to the heat sink’s fins. As air passes across the fins, it absorbs the heat, allowing the components to stay at a lower temperature. The ATS-03E-36-C2-R0 is designed to provide an efficient and reliable method of dissipating heat away from critical components.
The ATS-03E-36-C2-R0 is designed to provide a high level of cooling efficiency. The combination of materials used in its construction provides excellent thermal properties for efficient thermal dissipation. The pick-and-placeable design ensures the ATS-03E-36-C2-R0 can be easily integrated into any system. The ATS-03E-36-C2-R0 is an ideal thermal solution for applications that require high levels of thermal dissipation and maximum thermal capacity.
The specific data is subject to PDF, and the above content is for reference