| Allicdata Part #: | ATS-03E-41-C3-R0-ND |
| Manufacturer Part#: |
ATS-03E-41-C3-R0 |
| Price: | $ 6.73 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X17.78MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-03E-41-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.06123 |
| 30 +: | $ 5.72418 |
| 50 +: | $ 5.38751 |
| 100 +: | $ 5.05084 |
| 250 +: | $ 4.71412 |
| 500 +: | $ 4.37739 |
| 1000 +: | $ 4.29321 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become an important part of the manufacturing process as the demand for energy efficiency grows. Heat sinks are a critical component for cooling a variety of electronics and other thermal-sensitive products. One such component, the ATS-03E-41-C3-R0, is a low-cost, thermally-optimized, high-performance thermal interface material-based heat sink.
The ATS-03E-41-C3-R0 is designed for use in applications where maximum thermal performance is required while maintaining minimal cost. Its unique design features a flat, conductive surface area which provides excellent thermal performance when coupled with a compatible heatsink. The flat surface also helps reduce air leakage and keeps air inside the heatsink. This helps to minimize the fan noise of the system.
The ATS-03E-41-C3-R0 is capable of dissipating large amounts of heat, up to 75 watts, through its highly efficient aluminum-based design. Its uniquely designed heat sink features an optimized fin pattern which maximizes the cooling effect of high power electronics. The optimized fin pattern directs the air flow within the heat sink enabling efficient thermal performance. This thermal performance is further enhanced by the special thermally conductive interface material which is used on the top side of the heat sink.
The ATS-03E-41-C3-R0 is a self-contained heat sink, meaning no additional components are required to achieve the desired thermal performance. Its design eliminates the need to add a separate fan. Because of its small size, the ATS-03E-41-C3-R0 can be easily and safely installed in tight spaces, making significant cost savings in the installation process.
The ATS-03E-41-C3-R0 offers superior thermal performance due to its increased thermal mass and thermal conductivity. It is designed to be robust, so that it can tolerate a range of operating conditions. The low contact resistance and low thermal losses make it a great choice for applications requiring a high-performance, low-cost solution.
The ATS-03E-41-C3-R0 also has excellent thermal cycling properties which enable it to be used in a wide range of temperatures without limiting the performance of the device. This makes the ATS-03E-41-C3-R0 a great choice for applications where temperature fluctuations may be encountered.
In conclusion, the ATS-03E-41-C3-R0 heat sink is a great choice for thermal management applications which require high performance and low cost. It offers excellent thermal performance and is designed to be robust and efficient, making it a suitable choice for many types of applications. Its unique design and thermal performance make it an excellent choice for a wide variety of applications and a valuable addition to any thermal management system.
The specific data is subject to PDF, and the above content is for reference
ATS-03E-41-C3-R0 Datasheet/PDF