ATS-03E-64-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.49°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Heat sinks are components used to effectively dissipate heat that would otherwise be discarded in the form of energy to the surrounding environment. ATS-03E-64-C3-R0 is a thermal heat sink designed to keep components operating at the optimal temperature. It is also designed to maximize the effectiveness of an air-cooled system, providing cost-effectiveness and energy efficiency. In this article, we will look at the application field and working principle of the ATS-03E-64-C3-R0.

Application Field

The ATS-03E-64-C3-R0 thermal heat sink is designed for applications in which air-cooling is the primary form of cooling, such as high-end server cabinets and other industrial applications. Its compact design enables it to be used in applications with limited space. It is also suitable for applications where fans are not desired or cannot be used.The ATS-03E-64-C3-R0 is made of high-quality aluminum alloy in order to ensure reliability and strength. Its custom design ensures effective thermal dissipation across a wide range of temperatures. The thermal heat sink is also designed with multiple mounting points for easy installation, and features a durable powder-coated finish to resist corrosion and wear.

Working Principle

The ATS-03E-64-C3-R0 thermal heat sink works on the same basic principle as other thermal heat sinks. It uses the process of heat transfer to remove heat generated by components, such as processors and GPUs, from the inside of the system. This process involves the transfer of thermal energy from the hot components to the surface of the thermal heat sink. At this point, the surface of the thermal heat sink dissipates the heat energy into the surrounding environment. This is done by the natural convection of air currents, as the air currents move from warm areas to cool areas and exchange heat energy in the process. The surface of the thermal heat sink also acts as a radiator, drawing heat away from the components and dissipating it into the environment.In addition, the ATS-03E-64-C3-R0 thermal heat sink features a unique, patented fin design, which optimizes the heat transfer process between the components and the surface of the thermal heat sink. The fins feature multiple holes that allow for increased air circulation, which in turn leads to improved cooling efficiency and longer component life.

Conclusion

The ATS-03E-64-C3-R0 thermal heat sink is an efficient and cost-effective way to keep components operating at optimal temperatures. It utilizes the process of heat transfer, along with a unique fin design, to effectively transfer heat away from the components and into the surrounding environment. It is suitable for applications where air-cooling is the primary form of cooling, and its compact design makes it suitable for systems with limited space.

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