| Allicdata Part #: | ATS6771-ND |
| Manufacturer Part#: |
ATS-03E-72-C2-R0 |
| Price: | $ 5.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03E-72-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.95810 |
| 10 +: | $ 4.82328 |
| 25 +: | $ 4.55540 |
| 50 +: | $ 4.28740 |
| 100 +: | $ 4.01946 |
| 250 +: | $ 3.75150 |
| 500 +: | $ 3.48354 |
| 1000 +: | $ 3.41655 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.11°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential component of any electronic system. Heat builds up inside many electronic components, and if not managed properly through proper cooling and heat-dissipation solutions, the excess heat can shorten the life of the electronic components and even lead to system failure. The ATS-03E-72-C2-R0 is a type of heat sink that helps dissipate heat to maintain component longevity.
Heat sinks are passive heat exchangers that absorb, store, and dissipate thermal energy from one surface to another. An ATS-03E-72-C2-R0 is a cost-effective, compact, and lightweight heat sink that is designed for medium- to high-power applications with little need for airflow. It is constructed of extruded aluminum profiles and high-performance copper or aluminum heat pipes.
The ATS-03E-72-C2-R0 is designed to work in both natural-convection and forced-convection applications. It utilizes a specially-designed stepped configuration in order to maximize heat dissipation and minimize airflow obstruction. Heat sinks such as the ATS-03E-72-C2-R0 are used in applications that require heat dissipation, including active components such as processors and integrated circuits, as well as more industrial processes such as heat-curing applications.
The ATS-03E-72-C2-R0 features a natural, stepped configuration that helps distribute heat away from sensitive components. By providing a continuous flow of air and efficient heat dissipation, the ATS-03E-72-C2-R0 helps maintain desired temperatures, enabling stable operation for critical components. The heat sink is also designed to minimize airflow obstruction, reducing the chances of thermal hot spots and general cooling inefficiencies.
An ATS-03E-72-C2-R0 heat sink uses a direct-touch technology to effectively transfer heat away from critical components. The heat pipes transfer heat to the profiles, where it is then dissipated into the atmosphere. This ensures that components are kept at a steady temperature and are not subjected to significant fluctuations.
The ATS-03E-72-C2-R0 is a cost-effective, high-performance heat sink designed for medium- to high-power applications. It helps protect sensitive components from overheating by efficiently dissipating heat away from them. As part of a proper thermal management system, the ATS-03E-72-C2-R0 helps maximize component life and ensure system reliability and stability.
The specific data is subject to PDF, and the above content is for reference