ATS-03E-78-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.64°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-03E-78-C1-R0 Thermal – Heat Sinks Application Field and Working PrincipleThermal – Heat Sinks are an important component in power modules used for managing and transferring heat. The ATS-03E-78-C1-R0 model is a special type of Thermal – Heat Sink designed for high performing levels of thermal and power dissipation in small, limited-space applications.Application Field of the ATS-03E-78-C1-R0The ATS-03E-78-C1-R0 Thermal – Heat Sink is predominately designed to be used in applications where thermal transfer and dissipation are of paramount importance. These applications usually include high-power, small-space applications such as communications, data storage and computing, as well as automotive electronics, medical imaging and telecommunication infrastructure.The ATS-03E-78-C1-R0 is able to dissipate large and continuous loads of heat delivered by multiple high-powered ASICs, FPGAs and SoCs. It is able to meet the thermal requirements of these types of applications, whilst simultaneously being able to remain within the limited-space requirements.The advantages of using the ATS-03E-78-C1-R0 Thermal – Heat Sink in such applications are that it is able to provide superior levels of thermal performance due to its ability to continuously dissipate large amounts of heat in a limited space. Furthermore, the model is capable of cooling components of complex packages of up to approximately 55.0 °C — significantly above the accepted level of maximum acceptable temperature rise.Working Principle of the ATS-03E-78-C1-R0The ATS-03E-78-C1-R0 Thermal – Heat Sink uses its design to transfer and dissipate the heat from the module to the environment. This is achieved through the utilization of a combination of several processes that form its cooling technique.The primary process used in the ATS-03E-78-C1-R0 Thermal – Heat Sink is conduction. This involves the heat generated in the module being moved to the fins of the Heat Sink. This heat is then radiated out from the fins due to the difference in temperature. The Heat Sink also directing the heat away from the hotter components in the module with its designed “fanning” pattern so that the air within the application is not heated and more heat can be transferred.The secondary process employed in the heat transfer of the ATS-03E-78-C1-R0 Heat Sink is convection. This involves the hot air around the module being circulated out of the application by fans. This processes also helps to reduce the air temperature surrounding the components, and increases the airflow around the modules so that the heat generated can dissipate to the environment more efficiently.The third process used to dissipate heat from the modules is evaporation. This involves liquid, usually water, being pumped around the modules and heat from the modules being absorbed into the liquid. This liquid then evaporates away and the heat generated by the modules is taken with it.ConclusionThe ATS-03E-78-C1-R0 Thermal – Heat Sink is capable of providing superior thermal and power dissipation in small, limited-space applications. The Heat Sink utilizes the processes of conduction, convection and evaporation to enable the transfer and dissipation of heat generated in the module. This allows the components within the module to be kept at an optimum temperature so that they can perform optimally, without being affected by an increase in power or thermal output.

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