ATS-03E-96-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-03E-96-C3-R0-ND

Manufacturer Part#:

ATS-03E-96-C3-R0

Price: $ 4.77
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X35MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-03E-96-C3-R0 datasheetATS-03E-96-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.29156
30 +: $ 4.05279
50 +: $ 3.81452
100 +: $ 3.57607
250 +: $ 3.33766
500 +: $ 3.09926
1000 +: $ 3.03966
Stock 1000Can Ship Immediately
$ 4.77
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.73°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

.

Heat sinks are used to dissipate heat generated by electronic devices. In computers and other electronic systems, they help keep devices cool and prevent them from being damaged by heat. The ATS-03E-96-C3-R0 is a type of heat sink specifically designed for applications with high-power components such as LED Lighting, Automotive Electronics, and Power Electronics.

The ATS-03E-96-C3-R0 is a type of passive cooling system that uses air and/or metal conductors to carry heat away from critical components. It is composed of a series of fins that are connected to a base plate. Heat is transferred to the fins through conduction and is dissipated into the air. The fins are also designed with excellent air cooling characteristics to provide maximum cooling effect.

The ATS-03E-96-C3-R0 is capable of cooling components with high power densities and high heats sinking capability. This makes it ideal for use in applications that require reliable cooling of high-powered electronics. The heat sink also dissipates more heat than other heat sinks, making it more efficient in cooling electronics.

The ATS-03E-96-C3-R0 works by transferring heat from a hot component to a colder environment, such as the surrounding air. Heat is transferred by conduction through the fins to the base plate, and then to the air as the finned base plate radiates the thermal energy away. This is known as the forced-air convection process.

The ATS-03E-96-C3-R0 is available in different sizes and shapes to suit a wide range of applications. It can also be customized to fit specific thermal requirements. The heat sink can be easily mounted with existing mounting hardware, making installation and maintenance simple.

The ATS-03E-96-C3-R0 is an efficient way to cool electronic components and is particularly suited for applications with high-power components. Its excellent cooling capability and easy installation make it an excellent choice for engineers looking for reliable heat sinks.

The specific data is subject to PDF, and the above content is for reference

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