| Allicdata Part #: | ATS-03F-02-C1-R0-ND |
| Manufacturer Part#: |
ATS-03F-02-C1-R0 |
| Price: | $ 3.20 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03F-02-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.91249 |
| 30 +: | $ 2.83395 |
| 50 +: | $ 2.67649 |
| 100 +: | $ 2.51899 |
| 250 +: | $ 2.36157 |
| 500 +: | $ 2.28284 |
| 1000 +: | $ 2.04668 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
.Thermal – Heat Sinks
Heat sinks are highly conductive copper or aluminum objects designed to dissipate the heat generated by an electronic device. Heat sinks make use of conduction, through which heat is transferred from one material, the heat source, to another, the heat sink. Heat sinks are an integral part of modern electronic devices and are used in a variety of applications. One such example is the ATS-03F-02-C1-R0.
ATS-03F-02-C1-R0 Application Field
The ATS-03F-02-C1-R0 is a thermal heat sink used for power electronics applications such as servers, communication systems, and LED lighting. The ATS-03F-02-C1-R0 is designed for high-power, low-voltage, high-current environments, making it an ideal choice for applications where short-term power requirements are higher than can be handled by other materials. It is also highly heat-resistant, making it a perfect choice for applications where high temperatures will be encountered.
ATS-03F-02-C1-R0 Working Principle
The working principle of the ATS-03F-02-C1-R0 is based on the heat sink’s ability to dissipate heat rapidly away from the electronic components it is in contact with. The heat sink absorbs the energy from the device and transfers it outward to the surrounding environment. The size and material of the heat sink determines the rate of heat transfer, with larger and thicker materials transferring heat more quickly than smaller, thinner materials. The ATS-03F-02-C1-R0 also features a number of fins allowing for additional surface area for heat dissipation, further improving heat transfer performance.
Heat sinks also use convection, the natural tendency of heat to move from areas of higher temperatures to areas of lower temperatures, in order to dissipate heat. The heat sink has an internal air current which caused the heat from the device to move away from it and into the atmosphere. However, for optimal heat transfer performance, external fans and coolant pumps may need to be used to enhance convection.
The ATS-03F-02-C1-R0 also utilizes thermal insulation between components in order to ensure that adjacent components do not interfere with each other and reduce the overall thermal efficiency of the heat sink. Thermal insulation is a crucial feature and minimizes the risk of component overheating and damage.
Conclusion
The ATS-03F-02-C1-R0 is a highly effective heat sink, designed for use in a variety of electronic applications. By making use of conduction, convection, and thermal insulation, it efficiently transfers heat away from the device, preventing overheating and component damage. The ATS-03F-02-C1-R0 is an excellent choice for modern power electronics and provides a reliable and effective thermal management solution.
The specific data is subject to PDF, and the above content is for reference