| Allicdata Part #: | ATS-03F-10-C3-R0-ND |
| Manufacturer Part#: |
ATS-03F-10-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03F-10-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important part of any operating system. Too much heat can cause components to fail or to degrade in performance, while too little heat can reduce performance as well. One of the most important components of thermal management is the use of thermal heat sinks. A heat sink is an object, usually a metal block, that is used to dissipate thermal energy from the source to the environment. Heatsinks work in two ways, by conduction and convection. In conduction, heat is conducted directly from the source to the heatsink, while in convection, heat is generated by a heated material and transferred via air to a cooler material.
ATS-03F-10-C3-R0 is one of the most widely used thermal heat sinks. It is widely used in many different applications, such as computer processors, video cards and other components. It is made of aluminum and can provide excellent thermal conductivity. In addition, it has a very low profile, making it ideal for tight spaces. This heatsink also features a patented four-layer design, which allows for more efficient heat transfer over traditional single-layer designs. The four layers consist of a base layer, a thermal interface layer, a heat dissipator layer and an outer thermal protection layer.
The main working principle of the ATS-03F-10-C3-R0 is to remove heat from the device, usually a processor, and disperse the heat to the environment. Heat is transferred from the processor to the heatsink via conduction and convection. The heatsink then dissipates the heat via convection to the atmosphere. The heat dissipation is made possible by the special four-layer design of the heatsink which allows for efficient heat transfer. The heat is dissipated to the environment via the outer thermal protection layer.
The ATS-03F-10-C3-R0 is an effective way to cool a system and increase the lifespan of components. It can also help reduce noise and vibration which can be caused by inefficient cooling. This heatsink is a great way to improve overall system cooling and reduce operating temperatures. It is also easy to install, as all that is needed is to attach it to the device that requires cooling. This makes it ideal for both home and office use.
In conclusion, the ATS-03F-10-C3-R0 is a great thermal heat sink and it is well suited for a variety of applications. Its four-layer design provides efficient heat transfer and it can help reduce noise as well as improve overall system cooling. This heatsink is easy to install and it is highly durable, making it a great choice for many users and applications. With its low profile and great thermal performance, the ATS-03F-10-C3-R0 is an excellent choice for cooling components.
The specific data is subject to PDF, and the above content is for reference