| Allicdata Part #: | ATS-03F-110-C3-R1-ND |
| Manufacturer Part#: |
ATS-03F-110-C3-R1 |
| Price: | $ 5.26 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03F-110-C3-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.73067 |
| 30 +: | $ 4.46796 |
| 50 +: | $ 4.20512 |
| 100 +: | $ 3.94235 |
| 250 +: | $ 3.67953 |
| 500 +: | $ 3.41671 |
| 1000 +: | $ 3.35100 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-03F-110-C3-R1 is a thermal product which is used to prevent components from overheating and improve their overall life expectancy. It is commonly used in control cabinets, power transmission and distribution systems, industrial heat exchangers, and other high-temperature applications. The product is of great importance in the process of proper heat management. It helps maintain the ideal operating temperature of components and ensures optimal performance of the equipment.
The ATS-03F-110-C3-R1 belongs to the category of heat sinks, which are mechanical components specifically designed to absorb and dissipate heat away from a certain object, such as an electronic device. Heat sinks are typically made from metal, and they act as conductors of heat, taking it away from sensitive areas and dissipating it into the environment. Generally, the fins of a heat sink increase the surface area of the heat dissipation unit, allowing more efficient cooling.
The ATS-03F-110-C3-R1 heat sink is noteable for its compatibility with high-temperature applications, such as control cabinets and power transmission and distribution systems. It features a low-profile aluminum body, allowing it to fit into tight spaces with ease. Its low-weight design also makes it suitable for installations in hard-to-reach areas. Its efficient heat absorption and dissipation characteristics allow it to be used in various environments where air circulation is limited.
The working principle of the ATS-03F-110-C3-R1 is based on the fact that heat and cold are opposites and that heat will always flow from a hotter area to a colder area. When the heat sink is connected to the device, it absorbs the heat from the device, dissipating it away to the surrounding environment, thus maintaining the operating temperature of the device. The heat dissipates through both convection and radiation from the fins of the heat sink. The fins increase the surface area of the heat dissipation unit, allowing heat to dissipate more efficiently.
The ATS-03F-110-C3-R1 is designed for environments that do not have adequate air circulation. In these cases, the ATS-03F-110-C3-R1 is equipped with a fan to increase the flow of air around the heat sink, thereby increasing the rate of heat dissipation. The fan can be adjusted to control the air speed and keep the system at optimal levels. The product is also designed to be robust, providing years of reliable performance in the most demanding of applications.
Heat sinks are a vital component of maintaining optimal performance of any thermal system. The ATS-03F-110-C3-R1 is a high-performance heat sink designed specifically for high-temperature applications and tight spaces. It features a low-profile aluminum body, efficient heat absorption and dissipation characteristics, and a fan which increases air circulation around the heat sink. The ATS-03F-110-C3-R1 proves to be an invaluable tool for proper heat management and ensures optimal performance of equipment in difficult environments.
The specific data is subject to PDF, and the above content is for reference