| Allicdata Part #: | ATS-03F-124-C3-R0-ND |
| Manufacturer Part#: |
ATS-03F-124-C3-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03F-124-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.25°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat sinks are used in a variety of applications, as well as in the electronics industry to dissipate heat generated by electronic components. ATS-03F-124-C3-R0 is a particular type of thermal-heat sink used in a wide variety of applications. In this article, we will discuss the application field and working principle of ATS-03F-124-C3-R0.
ATS-03F-124-C3-R0 is a solid aluminum heat sink with a built-in fan, designed to dissipate heat from components. Its main application field is electronics, including computing and gaming systems, power supply, and industrial control chip. The efficient heat dissipation of the heat sink enables components to deliver consistent performance and optimal reliability. It is also designed with high power density, making it ideal for applications that require exact operating temperatures and reliable performance.
The working principle of ATS-03F-124-C3-R0 is based on the principles of heat transfer. An object or material emits and absorbs heat. The heat is then exchanged between the heat sink and the components. The heat sink is made of aluminum and it absorbs heat from the electronic components. The heat is then dissipated by the fan or by venting to the atmosphere. The fan is usually fixed at a specified speed and it blows air through the heat sink, taking the heat away from the components.
The ATS-03F-124-C3-R0 is designed to optimize efficient heat dissipation in a variety of applications. It is an ideal solution for applications where both fan and air convection are needed to maintain constant temperatures. It is also suitable for applications such as high-end gaming systems, industrial control chip, power supplies and many other applications where consistent performance and reliable temperature are essential.
In conclusion, ATS-03F-124-C3-R0 is a thermal-heat sink designed for efficient heat dissipation in a variety of applications. Its main application field is the electronics industry, where it dissipates heat generated by components. The working principle of the heat sink is based on heat transfer, in which heat is exchanged between the sink and the components and then dissipated. The fan is used to remove the heat from the components, allowing them to provide reliable performance and optimal reliability. This makes ATS-03F-124-C3-R0 an ideal thermal-heat sink solution for high-end gaming systems, industrial control chip, power supplies and other applications where reliable temperature is essential.
The specific data is subject to PDF, and the above content is for reference