| Allicdata Part #: | ATS6844-ND |
| Manufacturer Part#: |
ATS-03F-132-C2-R0 |
| Price: | $ 5.74 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03F-132-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.21640 |
| 10 +: | $ 5.07780 |
| 25 +: | $ 4.79581 |
| 50 +: | $ 4.51357 |
| 100 +: | $ 4.23152 |
| 250 +: | $ 3.94942 |
| 500 +: | $ 3.66732 |
| 1000 +: | $ 3.59680 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.66°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-03F-132-C2-R0 is a heat sink designed for use in thermal management applications. It is designed to dissipate large amounts of heat quickly, enabling better efficiency in any system. But what is this heat sink, and how does it work? Let’s take a closer look at the ATS-03F-132-C2-R0’s application field and working principle.
Applications
The ATS-03F-132-C2-R0 is best used in applications that require quick heat transfers between two components, such as electronic components, semiconductors, and lighting. It is especially designed to efficiently cool high-end chipsets and processors. It also performs well in automotive and other industrial applications.
The ATS-03F-132-C2-R0 is a highly reliable heat sink designed with a wide range of applications in mind. For example, it can be used on various heat-generating components such as transformers, PCIe cards, RAM, and GPUs. It is also perfect for use in cabinets and networking enclosures.
Design
The ATS-03F-132-C2-R0 is made of aluminum, making it lightweight and easy to install. It features a large base plate with multiple fins which provide a greater surface area for heat dissipation. It also comes with a fan bracket and mounting accessories that make installation simple. The fan bracket can also be used to place cooling fans that help dissipate the heat even further.
The base plate of the ATS-03F-132-C2-R0 is designed with small channels and groovings on its surface. This design improves the heat transfer between the heat sink and the component which the heat sink is connected to. This helps to improve the thermal performance of the device.
Working Principle
The ATS-03F-132-C2-R0 works on the same principle as other heat sinks. Heat sinks absorb and dissipate the heat produced by a component into the surrounding environment. Heat is first absorbed by the heat sink base plate which is then transferred to the fins through a direct contact. The heat is then dissipated into the air around the heat sink.
The ATS-03F-132-C2-R0 also comes with an optional cooling fan bracket. When installed, the fan helps to further dissipate the heat produced by the component. The fan helps to move the hot air away from the heat sink to the surrounding environment.
The ATS-03F-132-C2-R0 features a high-performance fin design and construction. This design provides a greater surface area for heat dissipation which helps to improve the efficiency of heat transfer. The wide orientation of the fins also helps to dissipate heat quickly.
Conclusion
The ATS-03F-132-C2-R0 is an excellent choice for use in thermal management applications. Its lightweight design and efficient heat dissipation make it a great choice for cooling high-end chipsets and processors in various applications. The included fan bracket can also help to provide additional cooling power in more demanding applications.
The specific data is subject to PDF, and the above content is for reference