| Allicdata Part #: | ATS6846-ND |
| Manufacturer Part#: |
ATS-03F-134-C2-R0 |
| Price: | $ 7.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X15MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03F-134-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 6.58350 |
| 10 +: | $ 6.40773 |
| 25 +: | $ 6.05203 |
| 50 +: | $ 5.69596 |
| 100 +: | $ 5.34001 |
| 250 +: | $ 4.98401 |
| 500 +: | $ 4.62801 |
| 1000 +: | $ 4.53900 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal energy has been widely used in a variety of applications and is essential for efficient performance of many systems. Heat sinks are components used to dissipate heat generated by a variety of sources such as computers, industrial machinery, power supplies, and motors. ATS-03F-134-C2-R0 is a specific type of heat sink. It is compact and highly efficient in dissipating heat. Its application field and working principle are summarized in this article.
Application Field
The ATS-03F-134-C2-R0 is designed for a variety of light to moderate thermal loads in automotive, medical, aerospace, telecommunications, consumer electronics, and other industrial applications. This heat sink offers long-term reliability and ruggedness due to its simple construction and high-quality materials. It is also designed to dissipate heat quickly and economically.
Working Principle
The ATS-03F-134-C2-R0 uses air-to-heat heat exchange to transfer thermal energy to the surrounding medium. It is made of high-purity aluminum which is known for its excellent thermal conductivity. The surface of the heat sink body has a series of hollow finning which is designed to increase the area of heat exchange with the surrounding environment. When a heat source, such as a chip, is placed on the heat sink, the heat is absorbed by the fins and transfers quickly to the environment due to the increased surface area. This efficient heat exchange will provide thermal stability and prevent the component from overheating.
Conclusion
The ATS-03F-134-C2-R0 is a compact and highly efficient heat sink designed to dissipate a variety of light to moderate thermal loads. It uses air-to-heat exchanger construction that offers long-term reliability and ruggedness. With its high thermal conductivity, this heat sink will quickly and efficiently transfer heat from a component to the surrounding environment, thus providing thermal stability. This heat sink is ideal for automotive, medical, aerospace, telecommunications, consumer electronics, and other industrial applications.
The specific data is subject to PDF, and the above content is for reference