| Allicdata Part #: | ATS-03F-150-C1-R0-ND |
| Manufacturer Part#: |
ATS-03F-150-C1-R0 |
| Price: | $ 3.64 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-03F-150-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.30498 |
| 30 +: | $ 3.21552 |
| 50 +: | $ 3.03698 |
| 100 +: | $ 2.85831 |
| 250 +: | $ 2.67964 |
| 500 +: | $ 2.59032 |
| 1000 +: | $ 2.32236 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a thermally-efficient method of dissipating electrical energy, and are used in many electronics and processing applications. The ATS-03F-150-C1-R0 is a type of heat sink designed for power-dense applications. It is made from aluminum and has a heat dissipation rate of 150 Watts per square centimeter.
The main components of this unit are the base fin grids, the fan, and the housing. The fan is what dissipates the heat away from the base fin grids. It spins at a high speed, which helps to efficiently transfer the heat away from the unit. The housing acts as a shield to protect the interior components from dust and debris. The main purpose of the housing is to keep the internal components from interacting with each other, as well as to allow for air flow.
The ATS-03F-150-C1-R0 works by converting electrical energy into thermal energy. As the electrical energy passes through the fins and fan, it is converted to heat. The fan spins quickly, creating an airflow that picks up the heat and carries it away from the unit. This helps to keep the internal components from becoming too hot and allows the unit to operate at peak efficiency.
This type of heat sink is ideal for applications that require power-dense cooling solutions. It is often used in electronics and power components for computers, medical equipment, telecom systems, and networking devices. It is also used in many other applications including automotive, transportation, industrial, and consumer markets.
The ATS-03F-150-C1-R0 is a highly efficient and cost-effective heat sink. It provides thermally efficient performance and can handle large amounts of heat. It is also relatively easy to install and maintain, making it a popular choice for many applications.
The specific data is subject to PDF, and the above content is for reference
ATS-03F-150-C1-R0 Datasheet/PDF