| Allicdata Part #: | ATS6864-ND |
| Manufacturer Part#: |
ATS-03F-150-C2-R0 |
| Price: | $ 4.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03F-150-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.83040 |
| 10 +: | $ 3.72456 |
| 25 +: | $ 3.51767 |
| 50 +: | $ 3.31065 |
| 100 +: | $ 3.10376 |
| 250 +: | $ 2.89684 |
| 500 +: | $ 2.68992 |
| 1000 +: | $ 2.63820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are crucial for electronic components to operate at their optimal level. Heat sinks are a popular and effective way to dissipate heat from electronics components. The ATS-03F-150-C2-R0 is a thermal-heat sink that has a wide range of applications and uses a fin design to help optimize its heat-dissipation capabilities.
The ATS-03F-150-C2-R0 is a low-profile thermal-heat sink designed for applications that require efficient heat dissipation. It uses a fin design to optimize airflow through the heat sink, allowing for fast and efficient heat transfer. The fins are made of high-quality materials, and their surfaces are treated with a black anodized finish that improves heat transfer and helps protect the heat sink from corrosion. The ATS-03F-150-C2-R0 also features two mounting brackets that are designed to ensure easy installation and secure mounting.
The ATS-03F-150-C2-R0 is designed for use with a variety of electronic components and applications. It is rated for use in temperatures up to 150°C, making it an ideal choice for high-temperature environments. It can be used to cool voltage regulators, power converters, FPGAs, flash memory, as well as other high-performance components.
The main working principle for the ATS-03F-150-C2-R0 thermal-heat sink is heat transfer. When an electronic component is placed on the heat sink, it begins to absorb heat. This heat is then dissipated through the fin design of the heat sink and into the surrounding environment. The heat sink uses the fin design to optimize the airflow through the fins, which maximizes its heat transfer capabilities. As the heat transfers through the heat sink, the cooling fins help to cool the electronic components. This ensures that the electronics component is able to operate at an optimal level.
The ATS-03F-150-C2-R0 is a reliable and effective thermal-heat sink that is designed for a variety of applications. It is highly efficient in dissipating heat from electronic components and its fin design helps to optimize its heat-transfer capabilities. Its easy installation and secure mounting make it ideal for a wide range of applications. The ATS-03F-150-C2-R0 thermal-heat sink is a great choice for anyone looking for an efficient way to keep their components cool.
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