| Allicdata Part #: | ATS6869-ND |
| Manufacturer Part#: |
ATS-03F-155-C2-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03F-155-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.92490 |
| 10 +: | $ 3.81717 |
| 25 +: | $ 3.60511 |
| 50 +: | $ 3.39293 |
| 100 +: | $ 3.18087 |
| 250 +: | $ 2.96881 |
| 500 +: | $ 2.75675 |
| 1000 +: | $ 2.70374 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.37°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become increasingly important as electronic devices have become more powerful and run at higher temperatures. Heat sinks are essential components in many electronics applications. The ATS-03F-155-C2-R0 is a heat sink designed to provide reliable thermal management for many types of applications.
The ATS-03F-155-C2-R0 is a two-piece aluminum and copper heat sink that offers excellent thermal conduction and distributed heat dissipation capabilities. The combination of aluminum and copper provides excellent thermal characteristics with superior heat transfer rates. In addition, the ATS-03F-155-C2-R0 has a built-in fan to further enhance thermal performance.
This heat sink can be used in a variety of applications, including those with areas that are difficult to cool due to their small size or poor air circulation. It can be used in applications such as automotive, medical, aerospace, industrial, and consumer electronics. In automotive applications, the ATS-03F-155-C2-R0 can be used to manage heat transfer from the engine compartment to keep components cool. In medical applications, it can be used to cool and control the temperature of imaging equipment and other sensitive equipment.
The ATS-03F-155-C2-R0 is designed to perform in harsh environments. It is made of durable materials that are resistant to extreme temperatures and corrosion. It also has a high surface area to provide a greater area of contact for enhanced thermal conduction. The fan is designed to operate quietly and provide efficient cooling.
The ATS-03F-155-C2-R0 is easy to install, and it comes with all the necessary mounting hardware. It has a simple design that allows for easy customization. The heat sink has an array of small fins that cover the aluminum block to increase the surface area for more effective heat transfer.
The working principle of the ATS-03F-155-C2-R0 is fairly simple. Heat is generated on the semiconductor device or other component it is attached to. This heat is transferred to the aluminum and copper blocks of the heat sink. The fins on the heat sink disperse the generated heat across its surface area. The fan then draws in cool air and circulates it through the fins, transferring heat away from the device and cooling it.
The ATS-03F-155-C2-R0 is an ideal solution for a wide variety of thermal management applications. Its combination of aluminum and copper provides excellent thermal conduction and distributed heat dissipation capabilities. Its built-in fan further enhances thermal performance and provides efficient cooling in even the harshest environments. Its simple design and easy installation make it an ideal choice for many applications.
The specific data is subject to PDF, and the above content is for reference