| Allicdata Part #: | ATS6876-ND |
| Manufacturer Part#: |
ATS-03F-161-C2-R0 |
| Price: | $ 4.69 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03F-161-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.25880 |
| 10 +: | $ 4.14099 |
| 25 +: | $ 3.91079 |
| 50 +: | $ 3.68084 |
| 100 +: | $ 3.45076 |
| 250 +: | $ 3.22071 |
| 500 +: | $ 2.99066 |
| 1000 +: | $ 2.93315 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.74°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-03F-161-C2-R0 Thermal - Heat Sinks Application Field and Working Principle
Heat sinks are commonly used in power electronics to dissipate heat and reduce the temperature of the system and its components. Thermal management is a major part of the design of power electronic systems, and this includes both active and passive approaches. Heat sinks are passive thermal management components that are usually made of aluminum or copper. Their large surface area is good for dissipating heat. The ATS-03F-161-C2-R0 is a type of thermal - heat sink from a leading manufacturer.
The ATS-03F-161-C2-R0 thermal - heat sink is designed for use in power electronic equipment in lower power applications. It is a V-shaped radiator with an air-flow vane design, which provides good air flow and heat dissipation. The heat sink is made of die-cast aluminum, which is lightweight, strong, and corrosion resistant. It has a black powder-coated finish to provide UV protection.
The ATS-03F-161-C2-R0 thermal - heat sink is designed for use in a variety of applications such as power supply, power amplifier, power LED, and any other energy-related device with a power range of 5 W to 300 W. The operating temperature range of this type of heat sink is from 0°C to 60°C, with a peak of 100°C. It also has an extremely high thermal cycling capacity due to its two-layer construction.
The working principle of the ATS-03F-161-C2-R0 thermal - heat sink is based on the laws of thermodynamics. Heat is transferred from the system to the heat sink to dissipate to the atmosphere. The air-flow vane design of the heat sink provides a large surface area for heat to be dissipated, and the aluminum construction facilitates heat transfer through conduction. The air flow is also increased by the vane construction, which allows for more heat to be removed from the system.
The ATS-03F-161-C2-R0 thermal - heat sink is an excellent choice for thermal management in power electronic applications. It is lightweight, strong, and corrosion resistant, making it an ideal solution for thermal management in both indoor and outdoor environments. Additionally, its two-layer construction provides a large surface area for heat dissipation, and its air-flow vane design increases the air flow to maximize heat dissipation. Therefore, the ATS-03F-161-C2-R0 thermal - heat sink is an excellent choice for thermal management in any power electronic application.
The specific data is subject to PDF, and the above content is for reference