| Allicdata Part #: | ATS-03F-17-C3-R0-ND |
| Manufacturer Part#: |
ATS-03F-17-C3-R0 |
| Price: | $ 4.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03F-17-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.80520 |
| 30 +: | $ 3.59415 |
| 50 +: | $ 3.38260 |
| 100 +: | $ 3.17123 |
| 250 +: | $ 2.95982 |
| 500 +: | $ 2.74840 |
| 1000 +: | $ 2.69555 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.51°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
ATS-03F-17-C3-R0 Application Field and Working Principle
Thermal - Heat Sinks
Heat sinks are metal components used for thermal management in a variety of applications, including power electronics, microelectronics, and other electronic components. The specific type of heat sink used for a given application depends on the area of the system that needs to be cooled and the environment it operates in. ATS-03F-17-C3-R0 is an example of a heat sink that is used for cooling a variety of electronic components and systems. This article will discuss the application field of the ATS-03F-17-C3-R0, as well as the working principle behind it.
The application field for the ATS-03F-17-C3-R0 includes a variety of electronic components and systems, such as computer processors, circuit boards, power supplies, and other electronic components. The ATS-03F-17-C3-R0 is well-suited for these applications because of its small size, high thermal conductivity, and high air-flow capabilities. Additionally, the ATS-03F-17-C3-R0 is designed to be durable and reliable, ensuring that it can handle the heat generated by the components it is cooling.
The main working principle of the ATS-03F-17-C3-R0 is based on convective cooling. Convection is the process of heat transfer between surfaces in contact with a fluid (air or liquid). In the case of the ATS-03F-17-C3-R0, air is the fluid used for convective cooling. The heat sink comprises a series of fins and a base plate, which increases its heat dissipation area. The heat from the component to be cooled is transferred to the base plate, and the fins then dissipate the heat to the surrounding air. The more efficient the heat transfer, the lower the temperature of the component. This process of heat transfer is further enhanced by the fan mounted on the top of the heat sink, which helps circulate the air and move it over the fins for optimal cooling.
In addition to convective cooling, the ATS-03F-17-C3-R0 also relies on radiative cooling. The fins of the heat sink are made of a material with high emissivity, allowing them to efficiently emit thermal radiation. This emitted radiation is then absorbed by the surrounding air, resulting in the air molecules being heated and creating a convective current. By using both convective and radiative cooling, the ATS-03F-17-C3-R0 is able to provide an effective cooling solution for a variety of electronic components and systems.
The ATS-03F-17-C3-R0 heat sink is a useful tool for cooling a variety of electronic components and systems. Its convective and radiative cooling capabilities make it suitable for a range of applications where an effective thermal management solution is needed. With its small size, durable construction, and efficient cooling properties, the ATS-03F-17-C3-R0 is a reliable and cost-effective solution for many thermal management needs.
The specific data is subject to PDF, and the above content is for reference