| Allicdata Part #: | ATS-03F-181-C3-R0-ND |
| Manufacturer Part#: |
ATS-03F-181-C3-R0 |
| Price: | $ 3.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03F-181-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.55131 |
| 30 +: | $ 3.35370 |
| 50 +: | $ 3.15643 |
| 100 +: | $ 2.95917 |
| 250 +: | $ 2.76189 |
| 500 +: | $ 2.56462 |
| 1000 +: | $ 2.51530 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential components in modern electronics and are used in a variety of applications. The ATS-03F-181-C3-R0 is a high-efficiency, thermally enhanced heat sink. It has a low profile and is designed for systems with limited space requirements. This heat sink features an anodized aluminum construction for superior thermal conductivity and long-term durability. It is ideal for use in a variety of electronic applications, including: power electronics, LED lighting, medical imaging systems, telecom equipment, and military and aerospace applications.The ATS-03F-181-C3-R0 heat sink utilizes a two-phase thermal system for maximum cooling effectiveness. The first phase is an extruded aluminum finned array that serves to disperse heat away from hot spots. This design also enhances the cooling efficiency of the heat sink. The second phase is a unique heat sink base that utilizes a micro-channel feature to increase heat transfer from the finned array to the cooling environment. The micro-channel feature also increases the surface area of the heat sink, providing abundant thermal potential.The ATS-03F-181-C3-R0 heat sink has a robust design with a 0.03" thickness, making it extremely lightweight. Its anodized aluminum construction and two-phase thermal system increases the cooling efficiency of the system compared to traditional heat sinks. It is ideal for dissipating the heat generated from high-powered electronics.The ATS-03F-181-C3-R0 has an optimized design with an open finned structure that increases air circulation around the heat sink. This increases the heat dissipation capabilities of the system. Additionally, the heat sink has an ultra-low thermal resistance, ensuring maximum thermal transfer from the component to the heat sink.The ATS-03F-181-C3-R0 heat sink is highly versatile and can be used in a variety of applications. It is optimized for use in power electronics, LED lighting, medical imaging systems, telecom equipment, and military and aerospace applications. The heat sink is also compatible with a wide range of component surface finishes, making it suitable for numerous thermal management applications.With its superior thermal conductivity, the ATS-03F-181-C3-R0 heat sink is the ideal choice for users who require a reliable and efficient cooling solution for their electronics. Its low-profile design and two-phase thermal system provide increased cooling capabilities, while its anodized aluminum construction ensures long-term durability. The ATS-03F-181-C3-R0 is an excellent option for any high-powered electronic application, providing reliable cooling for high-performance systems.
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