ATS-03F-197-C1-R0

Thermal - Heat Sinks

ATX-03F-197-C1-R0 is an innovative heat sink product developed as an excellent solution for thermal management. The product provides superior performance in any application where thermal performance is critical. This product is equipped with features such as a dynamic fin design, a matching heat spreader, and an integrated cooling system.

Application Field

ATX-03F-197-C1-R0 is specifically designed to improve the thermal performance of various electronic and semi-conductor devices. The product is most commonly used in line applications such as consumer electronics or those involving high-performance computing systems. Additionally, it is also a great option for applications such as industrial machines, medical instruments, and lighting applications.

Working Principle

The ATX-03F-197-C1-R0 utilises a dynamic fin design that increases the effective surface area of the heat sink, which causes the heat to be warded off more efficiently. Additionally, the product also utilises a thin film heat spreader, which helps uniform temperature saturation of the fin design for even greater thermal performance. Lastly, the product has an effective integrated cooling system which is designed to move the heat away from the fins and out of the device, thus, quickly and efficiently cooling the area.

The ATX-03F-197-C1-R0 is an ideal heat sink product that offers superior thermal performance without sacrificing quality. With its ability to perform consistently and efficiently in any challenging thermal environment, it ensures that the thermal performance of any device will be improved. The product’s affordable price point combined with its excellent functionality makes it a great option for anyone in search of an effective heat sink product.