| Allicdata Part #: | ATS-03F-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-03F-20-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03F-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A heat sink, sometimes known as a “cooler”, is a simple device designed to dissipate heat generated by electronic components. It is used to help maintain component temperatures at an acceptable level, and prevent system overheating. Heat sinks come in many shapes, sizes and materials, and are designed for use with a wide variety of circuits. The ATS-03F-20-C1-R0 is one such heat sink.
The ATS-03F-20-C1-R0 is a larger-than-average heat sink, with a width of 95 mm, length of 210 mm, and height of 50 mm. It is made of anodized aluminum, giving it excellent corrosion resistance in harsh environmental conditions. The heat sink features twenty fins that are evenly spaced around the top and bottom, providing excellent air circulation and cooling efficiency. It also features a raised lip along the side to keep the heat from escaping the heat sink and keep temperatures to a manageable level.
The ATS-03F-20-C1-R0 is an excellent choice for applications that require higher than average cooling performance. Its larger size and versatile shape make it suitable for a wide range of applications, including automotive components, power supplies, medical device cooling, and many others. It is a great choice for applications that are space-constrained, as its relatively compact size allows for greater flexibility in design.
In terms of heat conducting capabilities, the ATS-03F-20-C1-R0’s aluminum construction provides excellent thermal conductivity and is highly resistant to thermal cycling. This makes it well-suited for applications running hot for extended periods of time, as the heat sink can dissipate large quantities of heat before needing to be replaced.
The working principle of the ATS-03F-20-C1-R0 is relatively simple. Heat is transferred from the component to the heat sink, where it then dissipates into the surrounding air. The fins throughout the heat sink allow for increased air circulation, which helps to improve cooling efficiency by providing more areas for the heat to disperse. This in turn helps to keep component temperatures under control, eliminating the potential for system failure due to overheating.
In conclusion, the ATS-03F-20-C1-R0 is an ideal choice for applications that require higher than average cooling performance. Its larger size and versatile shape make it suitable for a wide range of applications, with excellent thermal conductivity for long-term use. Its working principle is simple, and the twenty fins allow for increased air circulation, which helps to improve cooling efficiency. Overall, the ATS-03F-20-C1-R0 is an excellent choice for thermal applications.
The specific data is subject to PDF, and the above content is for reference