| Allicdata Part #: | ATS-03F-36-C1-R0-ND |
| Manufacturer Part#: |
ATS-03F-36-C1-R0 |
| Price: | $ 5.26 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X11.43MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03F-36-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.73067 |
| 30 +: | $ 4.46796 |
| 50 +: | $ 4.20512 |
| 100 +: | $ 3.94235 |
| 250 +: | $ 3.67953 |
| 500 +: | $ 3.41671 |
| 1000 +: | $ 3.35100 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.81°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an increasingly important aspect of modern electronics. Heat generated by electronic components must be dissipated safely, in order to ensure proper operation and prevent potential damage. Heat sinks are an essential part of any thermal management system, and the ATS-03F-36-C1-R0 is a reliable and robust solution.
The ATS-03F-36-C1-R0 is an extruded aluminum heat sink, designed for a broad range of applications. It is versatile enough to be used in any application where efficient heat dissipation is required. It is constructed with a high-quality aluminum profile, and has a beveled fin design, allowing for maximum heat transfer. It also features an aesthetically pleasing design, with a rugged black anodized finish.
The ATS-03F-36-C1-R0 is a great choice for applications such as power supplies, LED lighting, power converters, and other high-power applications. It is also ideal for small form factor applications, such as laptop computers and embedded systems. It can be mounted both horizontally and vertically, allowing for flexibility in the thermal solution.
The ATS-03F-36-C1-R0 is designed to be extremely efficient, and is capable of transferring large amounts of heat away from electronic components. It can also be customized to fit specific applications, with additional features such as fans and heat pipes.
The ATS-03F-36-C1-R0 is easy to install and offers a reliable solution to thermal management challenges. It utilizes a unique design which utilizes the natural convection of hot air and radiation from the electronics. This ensures efficient heat transfer, even without the use of fans or other add-ons. As an added benefit, its low profile design helps save valuable space in crowded electronics enclosures.
The ATS-03F-36-C1-R0 is an excellent choice for any application requiring effective thermal management. It offers a reliable and robust solution to help ensure that electronic components operate safely and optimally. With its customizable features, easy installation, and low profile design, it is the perfect choice for a broad range of thermal management needs.
The specific data is subject to PDF, and the above content is for reference