ATS-03F-36-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	1.450" (36.83mm)
Width:	2.267" (57.60mm)
Diameter:	--
Height Off Base (Height of Fin):	0.450" (11.43mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	14.82°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks: ATS-03F-36-C2-R0 Application Field and Working Principle

Thermal-Heat sinks are electrical components designed to absorb heat from processors, transistors, and other electronic components. Thermal-heat sinks come in a variety of shapes and sizes, and the size and shape of the heat sink must be carefully chosen for the application. The ATS-03F-36-C2-R0 heat sink is a 36-inch square, low-height, aluminum profile solution. It is suitable for most small- and medium-sized processors. The ATS-03F-36-C2-R0 heat sink is designed to be a highly efficient device. It is constructed from aluminum with an aluminum base plate, fins, and a special pitch or twisted fin structure that provides a large surface area for maximum heat dissipation. The custom twisted fin technology helps to optimize airflow and improves heat transfer from the heat sink to the air. Additionally, the twisted fin technology prevents dirt and dust accumulation which can decrease airflow and cooling performance. The aluminum base plate is designed with slots that form air passages for efficient air-to-surface heat exchange and increases surface thermal conductivity. The ATS-03F-36-C2-R0 heat sink uses the convection cooling method, which is the most efficient cooling method for small- and medium-sized processors. Convection cooling works by the hot processor transferring thermal energy to the air through direct contact. Adequate airflow is critical for product and system reliability. The ATS-03F-36-C2-R0 features a passive fanless cooling system, although fans can be added for maximum cooling performance. The ATS-03F-36-C2-R0 is fully customizable and can be designed with various cold plate mounting options, thermal interface materials, and other configurations to suit any application. It is compatible with contemporary processor technology including Intel Core 2, Core i7, AMD 64/65 processors, and others, and is suitable for use in a variety of computer cases, CPU coolers, industrial enclosures and other pc applications. The ATS-03F-36-C2-R0 is equipped with multiple mounting holes for easy installation in any type of system. The ATS-03F-36-C2-R0 heat sink is manufactured with a unique manufacturing process to ensure optimal heat transfer and maximum system reliability. The heat sink is constructed under strict quality control standards and is tested to ensure it meets all the requirements for its intended application. It is RoHS compliant and available in a number of different finishes including black anodized, chrome plated, and natural white. The ATS-03F-36-C2-R0 is a cost effective solution for cooling processors, transistors and other electronic components. Its efficient and reliable performance and its cost effectiveness make it an ideal choice for a wide range of applications. The ATS-03F-36-C2-R0 heat sink is a great choice for keeping your processor cool and running at optimal levels.

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