| Allicdata Part #: | ATS-03F-37-C1-R0-ND |
| Manufacturer Part#: |
ATS-03F-37-C1-R0 |
| Price: | $ 5.43 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X17.78MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03F-37-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.88124 |
| 30 +: | $ 4.60992 |
| 50 +: | $ 4.33881 |
| 100 +: | $ 4.06766 |
| 250 +: | $ 3.79648 |
| 500 +: | $ 3.52531 |
| 1000 +: | $ 3.45751 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.10°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A thermal heat sink is an important device used in any structure that requires heat to be transferred away from a heated component, such as a hot circuit board. The ATS-03F-37-C1-R0 heat sink is a specialized version of the thermal heat sink that offers exceptional performance. This article will discuss the application field and working principle of the ATS-03F-37-C1-R0 heat sink.
The ATS-03F-37-C1-R0 heat sink is an aluminum heat sink designed primarily for use in electronic applications such as CPUs and GPUs. It offers superior heat transfer capability due to its low thermal resistance, low weight, and high thermal conductivity. This makes it an ideal choice for applications where space is limited and maximum thermal performance is required. It is designed with an arrangement of fins which helps to optimize the heat transfer process and dissipate the heat effectively. It has an integrated fan which helps to further improve the cooling performance.
The ATS-03F-37-C1-R0 heat sink is primarily used in personal computers, laptops, and other electronic devices. It is designed to be used with CPUs, GPUs, and other components that generate a lot of heat. It can also be used in other electronics such as digital signal processors and microcontrollers. In addition, it can be used in other applications such as automotive cooling.
The working principle of the ATS-03F-37-C1-R0 heat sink is based on convection. The heat from the components is transferred to the fins of the heat sink, and then the heat is dissipated to the surrounding air through convection. This process is helped by the integrated fan, which helps to draw cooler air around the fins of the heat sink, thereby increasing the rate of heat transfer.As the heat is dissipated to the surrounding air, the heat sink cools down, resulting in a lower temperature, and thus a higher level of efficiency. This improves system performance and can help to prevent overheating and other thermal issues.
The application field of the ATS-03F-37-C1-R0 heat sink is vast. It is an ideal choice for electronics such as CPUs, GPUs, and other components that generate large amounts of heat. It is also suitable for automotive cooling and other industrial applications. Additionally, it can be used in medical devices, as it provides reliable thermal performance that can help to ensure patient safety.
In conclusion, the ATS-03F-37-C1-R0 heat sink is a specialized thermal heat sink that offers superior performance and reliability. It is well-suited for use in electronics, automotive applications, and other industries. The device works by transferring heat away from the components to the fins of the heat sink, where it is then dissipated to the surrounding air through convection. This helps to keep temperatures low and improve system performance and reliability.
The specific data is subject to PDF, and the above content is for reference