| Allicdata Part #: | ATS6945-ND |
| Manufacturer Part#: |
ATS-03F-48-C2-R0 |
| Price: | $ 3.95 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X35MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03F-48-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.59100 |
| 10 +: | $ 3.49335 |
| 25 +: | $ 3.29918 |
| 50 +: | $ 3.10502 |
| 100 +: | $ 2.91098 |
| 250 +: | $ 2.71691 |
| 500 +: | $ 2.52285 |
| 1000 +: | $ 2.47433 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.51°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat Sinks have been used for many applications, ranging from automotive engines to computers and other electronic equipment. The ATS-03F-48-C2-R0 is a form of heat sink that is most commonly used in application fields with a focus on reliability and safety. This article will explain the application field and working principle of the ATS-03F-48-C2-R0 thermal - heat sink.
The ATS-03F-48-C2-R0 thermal - heat sink is commonly used in application fields with a focus on processing data and information that requires processing that requires a cool environment. As such, it is most commonly used in the computing, communications, and industrial control sectors. It is also commonly used in the areas of transportation, medical technology, aerospace, and military systems. By using the ATS-03F-48-C2-R0 thermal - heat sink, it is possible to maintain the temperatures required to protect electronic equipment, ensure reliability, and run safely.
The working principle of the ATS-03F-48-C2-R0 thermal - heat sink is based on the concept of thermal conduction and the principles of thermodynamics. Thermal conduction takes place when heat energy is transferred from one area to another through direct contact, while thermodynamics explains the principles of heat transfer and the laws of energy conservation. When the ATS-03F-48-C2-R0 thermal - heat sink is attached to an electronic component, the heat generated by the component is dissipated into the surrounding environment as a result of the heat transfer.
The ATS-03F-48-C2-R0 thermal - heat sink is designed to maximize the efficiency of the heat transfer process. This is done by enhancing the thermal conductivity of the heat sink material and utilizing grooves and channels in the design to increase the surface area available for the heat transfer process. The individual fins of the heat sink are designed to create turbulence in the air stream. This turbulence helps to disrupt the laminar flow of air over the heat sink and improves the overall efficiency of the heat transfer process.
In addition, the ATS-03F-48-C2-R0 thermal - heat sink is designed with a low thermal resistance. This means that the thermal resistance between the component and the heat sink is minimized, allowing for better heat transfer and dissipation. This allows for efficient cooling of electronic components and improved reliability and safety.
The ATS-03F-48-C2-R0 thermal - heat sink is designed to provide reliable and efficient heat transfer and cooling for electronic components in applications with a focus on reliability and safety. Its design enables it to provide efficient heat transfer and dissipation, as well as improved reliability and safety for electronic components in these application fields.
The specific data is subject to PDF, and the above content is for reference