| Allicdata Part #: | ATS-03F-49-C3-R0-ND |
| Manufacturer Part#: |
ATS-03F-49-C3-R0 |
| Price: | $ 3.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03F-49-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.16197 |
| 30 +: | $ 3.07671 |
| 50 +: | $ 2.90581 |
| 100 +: | $ 2.73489 |
| 250 +: | $ 2.56397 |
| 500 +: | $ 2.47851 |
| 1000 +: | $ 2.22211 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.55°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are an important component of many digital electronic systems, providing efficient heat transfer and thermal dissipation. As such, it is not surprising that there are a wide variety of thermal heat sinks available on the market. The ATS-03F-49-C3-R0 is a specific type of heat sink used for cooling of electronic components. By understanding this product and its application in thermal management, an engineer can properly utilize it in their projects.
The ATS-03F-49-C3-R0 is a high performance, medium-sized passive heat sink for electronics cooling. It is designed to accept a wide range of heat dissipating components such as DIPs, SIPs, and BGA packages. This heat sink features highly efficient thermal characteristics and is ideal for ambient temperatures from -10°C to 100°C (-14°F to 212°F).
This heat sink is designed to provide efficient cooling of electronic components, via conduction. Basically, when an electronic component generates heat, this heat will be transferred through the heat sink until it reaches ambient air. Forced air cooling systems can also be used with the ATS-03F-49-C3-R0, if the application requires higher cooling efficiency.
The ATS-03F-49-C3-R0 is made from a high-grade aluminum material with the proprietary Pin-Fin design, contributing to its efficient cooling characteristics. The heat sink also has an array of 28 fins to optimize its thermal cycling performance. It operates at a thermal resistance of 0.73 °C/W, making it suitable for a wide range of commercial and industrial applications.
Coming in at only 69.8mm in all three dimensions, the ATS-02F-49-C3-R0 is quite compact. This makes it ideal for use in confined spaces, such as those found in laptops and other thin form factor applications. The small size makes it very easy to install in tight spaces with little room for heat dissipation.
The ATS-02F-49-C3-R0 also features a variety of mounting options. It can be mounted with either screws/washers, or can be soldered directly onto a board. The choice of mounting method will depend on the application, and whether the board can handle the heat generated.
The ATS-02F-49-C3-R0 is designed to be maintenance-free, meaning that no cleaning is required. It also isn’t subject to corrosion, ensuring it always remains efficient. This product is extremely reliable and can provide long-term cooling solutions for electronic systems.
Overall, the ATS-02F-49-C3-R0 is a high-performance heat sink that is suitable for cooling a wide range of electronic components. It features an array of 28 fins, a high-grade aluminum material, and a 0.73 °C/W thermal resistance. The compact size makes it ideal for many small form factor applications, while the various mounting options make it incredibly versatile.
The specific data is subject to PDF, and the above content is for reference