ATS-03F-59-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.181" (30.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.08°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are designed to keep temperature levels optimized for more efficient performance. The ATS-03F-59-C3-R0 is a heat sink with superior thermal performance. It is designed to properly manage and maintain temperature, allowing superior airflow and cooling to maximize output. This heat sink also has a unique structure and materials that ensure a longer lifespan.

Features

The ATS-03F-59-C3-R0 is designed to handle the most demanding temperatures. It features a unique combination of materials that absorbs and dissipates heat faster than traditional materials. Its optimized air-flow design also ensures high air velocity, which helps ensure its maximum cooling performance. It also has a unique structure that helps reduce electromagnetic interference and sound.

Construction

The ATS-03F-59-C3-R0 is made up of three main components; a base plate, a heat sink, and a fan. The base plate is made of high quality aluminum, which serves as a support base for the heat sink and fan. The heat sink itself is made of a combination of metals, including copper and aluminum, which helps absorb and dissipate heat more quickly and efficiently. The fan is a PWM-controlled fan, which helps move air around the heat sink and provide maximum cooling efficiently.

Applications

The ATS-03F-59-C3-R0 is designed for a wide range of applications. Its superior design and construction make it suitable for demanding environments, such as those found in computers and electronic devices. Its compact size also makes it a great choice for applications that require a smaller heat sink and fan, such as those found in compact electronic devices.

Working Principle

The ATS-03F-59-C3-R0 works by drawing heat away from the source device and dispersing it into the air. This is done by creating a temperature gradient around the heat sink, with the hot air being forced to the outside of the heat sink, and cool air entering the center. This process helps to keep the temperature of the source device from getting too high, which can lead to damage or reduced performance. Additionally, the fan helps to move air around the heat sink, increasing the air velocity and thus, pushing the warm air away from the surface being cooled.

Conclusion

The ATS-03F-59-C3-R0 is an excellent thermal - heat sink solution for a variety of applications. It offers superior thermal performance, a unique combination of materials, and a compact size, all of which make it great for a variety of applications. Its superior air-flow design allows for maximum cooling efficiency, protecting any device that is connected to it from becoming too hot, and its PWM-controlled fan helps to move air around the heat sink to ensure maximum air velocity and cooling performance.

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