
Allicdata Part #: | ATS-03F-63-C3-R0-ND |
Manufacturer Part#: |
ATS-03F-63-C3-R0 |
Price: | $ 4.16 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 40X40X20MM L-TAB T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.78252 |
30 +: | $ 3.57231 |
50 +: | $ 3.36206 |
100 +: | $ 3.15195 |
250 +: | $ 2.94182 |
500 +: | $ 2.73169 |
1000 +: | $ 2.67917 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.575" (40.00mm) |
Width: | 1.575" (40.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.790" (20.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 12.42°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are convenient and cost-effective thermal solutions, used in a variety of commercial and industrial applications. The ATS-03F-63-C3-R0 is a specialized heat sink, designed for applications in the electronics industry, where it is used to dissipate waste heat generated by electronic components. This type of heat sink offers a number of key benefits, such as improved thermal performance, reduced acoustic noise, and increased dissipated power.
The ATS-03F-63-C3-R0 is a flow-through type of heat sink, in which air flows through the fins of the heat sink. This ensures maximum thermal efficiency, as air is uniformly distributed and the heat is quickly transferred out of the heat sink. The fins of the heat sink are made from aluminum, which is an ideal material for dissipating heat, due to its high thermal conductivity. The aluminum fins are also designed to maximize the surface area, allowing more heat to be effectively managed.
The working principle of the ATS-03F-63-C3-R0 heat sink is based on convection heating. Instead of relying on traditional thermal insulation, the heat sink allows air to move freely through its fins, dissipating heat more quickly and reducing hot spots within the system. This helps keep components cooler, improving their reliability and lifespan. The convection process is also more effective than traditional air-cooled methods, as it allows more precise temperature control in the system.
The ATS-03F-63-C3-R0 is designed for use in a wide variety of applications where heat management is critical. This type of heat sink is often used in larger industrial applications, as its efficient convection based cooling system can effectively dissipate waste heat from high-power components. Additionally, the heat sink can be used in automotive, consumer electronics, computer peripherals, and medical equipment applications.
The ATS-03F-63-C3-R0 offers a number of additional benefits, such as a compact profile, light aluminum construction, and a flexible mounting frame. The heat sink’s small size makes it easy to install in tight spaces, while its aluminum construction helps to reduce weight and improve heat dissipation. Additionally, the ATS-03F-63-C3-R0 has a flexible mounting frame, allowing it to be easily installed in various applications.
By utilizing an efficient convection-based cooling system, the ATS-03F-63-C3-R0 offers a reliable and cost-effective solution for dissipating waste heat in electronic component applications. Its light aluminum construction and flexible mounting frame make it ideal for a variety of different applications, while its compact profile makes it easy to install in tight spaces. Overall, the ATS-03F-63-C3-R0 is an ideal thermal solution for various industrial and commercial applications.
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