| Allicdata Part #: | ATS-03F-73-C1-R0-ND |
| Manufacturer Part#: |
ATS-03F-73-C1-R0 |
| Price: | $ 3.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03F-73-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-03F-73-C1-R0 is a type of thermal management component classified under heat sinks. Heat sinks are devices used for cooling electronics and other components in a system. By dissipating heat in an efficient and effective way, they reduce operational temperatures and prevent the system from experiencing damage due to too much heat.
The specific model named ATS-03F-73-C1-R0 is used for wide-range application. It is an efficient and multi-functional device whose design makes it both durable - combined with copper-base and aluminum alloy construction - and light weight. The model is constructed with a large number of improved features for ensuring performance, such as greater temperature accuracy and heat dissipation. Furthermore, it has low thermal resistance and an increased surface area with evenly distributed fins. This makes it suitable for applications requiring high thermal performance and accurate temperatures.
The ATS-03F-73-C1-R0 is primarily used in electronics and computer engineering, although its wide-reaching capabilities make it ideal for application in a variety of industries, such as telecommunications, medical equipment and robots. The model is designed with high efficiency and low-operating temperatures in order to provide reliable thermal stability and performance. Its size is 145.4 cm2 and its weight is 0.4 kg, both of which enable easy installation in tight spaces.
The working principle of the ATS-03F-73-C1-R0 is simple. Heat is generated by the electronic components and is transferred to the fins of the heat sink. From there, the air surrounding the heat sink is heated, thereby increasing air circulation and cooling the fins. This helps to dissipate the heat properly, which, in turn, allows the components to remain at optimal temperatures. Furthermore, a fan can be installed for increased efficiency in the cooling process.
Overall, the ATS-03F-73-C1-R0 provides many advantages over traditional heat sinks. Its efficient and light-weight design - along with its excellent temperature accuracy, wide-ranging application and simple working principle - makes it ideal for cooling components in many industries. This type of thermal management component is a versatile and reliable device that ensures maximum performance while reducing operational costs.
The specific data is subject to PDF, and the above content is for reference