ATS-03F-78-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.98°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat SinksHeat sinks are designed to dissipate heat by transferring it away from a component or object and dissipating it into the environment. There are many different types of heat sinks available, including both passive and active versions. Among them is the ATS-03F-78-C3-R0, an air-cooled heat sink designed for thermal control applications. The following is a look at its application field and working principle.ApplicationsThe ATS-03F-78-C3-R0 heat sink is typically used in electronic equipment applications where its primary purpose is to act as a heat dissipater to prevent components from being damaged due to overheating. It is widely used as a cooling solution for high-power electronic circuits, such as power/battery management, automotive electronics, memory modules, FPGAs, VRMs, and more. The manufacturers also recommend this heat sink for cooling applications with higher ambient temperatures (up to 85°C).Working PrincipleHeat sinks are designed to dissipate heat or thermal energy from its source. The ATS-03F-78-C3-R0 functions in a similar way. It works by transferring thermal energy from the component or object into the air around it via a convection process. The heat sink consists of a metal frame with several fins placed strategically along the edges. These fins absorb the heat from the component and create air turbulence around it, which helps draw the heat away. This combination of air flow and thermal capacitance allow the heat sink to effectively disperse the thermal energy acquired from the source.FeaturesThe ATS-03F-78-C3-R0 is manufactured from aluminum (Al6063) and is designed for optimal thermal performance. The heat sink is equipped with an active airflow regulator which enables the user to customize the amount of air entering the sink. It is also highly durable, with a corrosion-proof and rugged design. The heat sink is resistant to thermal shock and is rated up to a temperature of 85°C. In addition, the ATS-03F-78-C3-R0 offers excellent mechanical strength and is UL approved.ConclusionThe ATS-03F-78-C3-R0 thermal heat sink is a highly efficient cooling device that is designed to dissipate heat away from a component or object by transferring it into the surrounding air. It is an ideal cooling solution for a variety of high-power electronics applications and is highly durable, corrosion-proof, and UL approved. With its adjustable airflow and superior thermal performance, the ATS-03F-78-C3-R0 is a reliable and cost-effective cooling solution.

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