| Allicdata Part #: | ATS-03F-81-C3-R0-ND |
| Manufacturer Part#: |
ATS-03F-81-C3-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03F-81-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-03F-81-C3-R0 is a type of thermal - heat sink. It is mainly used for cooling the electronic components in electronic devices, such as computers, televisions, and other equipment. Heat sinks are used to dissipate heat away from components and other sensitive equipment. Heat sinks are designed to absorb and store heat and then release it to keep device temperatures within desired levels.
The ATS-03F-81-C3-R0 consists of a copper or aluminum base, which is connected to the device to be cooled, and a series of fins that are connected to the base by heat pipes. This allows the heat to be dissipated through the fins and into the environment. Heat is generated from the electrical components that are connected to the device. The fins act as a path for the heat to travel to, allowing it to dissipate away from the device.
The ATS-03F-81-C3-R0 also has a liquid cooling system that is connected to the base. The liquid is circulated through the coolant channels and absorbs the heat in the fins. This liquid then transfers the heat to a radiator, where the heat dissipates away from the device. The liquid is cooled and then re-circulated back into the fins, where it absorbs more heat. This process is repeated until the desired temperature is reached.
The ATS-03F-81-C3-R0 is also designed to provide an efficient airflow through the device. The airflow is directed over the fins, allowing the heat to be dissipated quickly and efficiently. This can help to reduce the overall temperature of the system, and make sure that the device operates at the optimal temperatures.
The ATS-03F-81-C3-R0 is designed for use in a variety of applications. It is most commonly used in computers, televisions, and other electronic equipment. It can also be used in industrial applications, such as cooling welding or high-voltage equipment. The ATS-03F-81-C3-R0 is also suitable for use in high-power applications, such as telecommunications and other high-power electronics.
The ATS-03F-81-C3-R0 is an efficient and reliable thermal - heat sink solution. It is designed to provide effective cooling of electronic components, and help to keep device temperatures within a desired range. The efficient airflow and liquid cooling system ensure that the device operates efficiently and safely.
The specific data is subject to PDF, and the above content is for reference