| Allicdata Part #: | ATS-03F-86-C3-R0-ND |
| Manufacturer Part#: |
ATS-03F-86-C3-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03F-86-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.33123 |
| 50 +: | $ 3.14622 |
| 100 +: | $ 2.96113 |
| 250 +: | $ 2.77603 |
| 500 +: | $ 2.68350 |
| 1000 +: | $ 2.40589 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.86°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-03F-86-C3-R0 application field and working principle
The ATS-03F-86-C3-R0 is a thermal-heat sink used in the cooling of electronic components. It is constructed of anodized aluminum and features an innovative thermal design to improve the heat dissipation rate. It has many applications in electronics, particularly in the data processing, communication, and industrial control fields.
Design and Structure
The ATS-03F-86-C3-R0 features a flat fins profile design with densely packed major cooling fins. This design helps to increase the available surface area and increase the heat dissipation efficiency. The fins are constructed of 0.35mm thick anodized aluminum, and the base is designed with a heat spreading layer of integrated sleeve on the surface of the base. This helps to reduce the hot-spot areas in the heat sink, and improve the thermal performance of the device.
Mounting
The ATS-03F-86-C3-R0 includes screws in the package for mounting onto circuit boards. The mounting height of the device is predetermined for easier installation, and generally should not exceed the values given in the product specifications. The heat sink should be aligned with the component it is cooling, and the mounting screw should be tightened to obtain the best thermal performance.
Thermal Performance
The ATS-03F-86-C3-R0 is designed for use in applications requiring a higher thermal performance than traditional cooling solutions. It can provide better heat dissipation than air-cooling, and can also improve temperature uniformity in the region. The thermal resistance rating of the device is 0.4 °C/W, and it can handle an ambient temperature up to 70 °C.
Conclusion
The ATS-03F-86-C3-R0 thermal-heat sink provides an innovative solution for the cooling of electronic components. It features a flat fins profile design with densely packed major cooling fins, designed for improved heat dissipation efficiency. Its thermal resistance rating is 0.4 °C/W, and it can handle an ambient temperature up to 70 °C. With its low profile and highly efficient design, it is an ideal choice for many commercial and industrial applications.
The specific data is subject to PDF, and the above content is for reference