| Allicdata Part #: | ATS-03F-92-C1-R0-ND |
| Manufacturer Part#: |
ATS-03F-92-C1-R0 |
| Price: | $ 3.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03F-92-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.16197 |
| 30 +: | $ 3.07671 |
| 50 +: | $ 2.90581 |
| 100 +: | $ 2.73489 |
| 250 +: | $ 2.56397 |
| 500 +: | $ 2.47851 |
| 1000 +: | $ 2.22211 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 16.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-03F-92-C1-R0 is a thermal-heat sink product used in a variety of applications. It is designed to transfer heat away from electronic components and systems. It works by dissipating heat from the component or system through air convection and radiation. The device is suitable for both air-cooled and water-cooled applications.
The heat sink works by creating an insulated space between the component or system and the air. This space acts as a barrier to the ambient air, preventing heat gain from the outside. When the air inside the heat sink is heated by the component or system, it starts rising. As it rises, it displaces cooler air from the bottom, pushing it up and over the component or system. This creates a circulation of air that continuously transfers heat away from the component or system.
The heat sink is made up of several components. The base is made of a dielectric material such as aluminum, copper or brass. The bottom of the base is designed so that heat can be easily released into the surrounding environment. On top, there are fins that increase the surface area, allowing more air to be heated and moved away from the component or system. These fins are usually made from aluminum, copper or plastic.
The ATS-03F-92-C1-R0 can be used in a variety of applications. In electronic systems, it can be used to dissipate thermal energy from components such as processors, memory chips, and power supplies. In automotive applications, it can be used to dissipate heat from brake calipers, engine blocks and other high-heat areas. In industrial applications, it can be used to remove heat from machine parts, welds, and other areas with high temperatures.
The ATS-03F-92-C1-R0 is easy to install and maintain. It is designed to be mounted onto a flat surface with two screws. The heat sink fins can be cleaned with a soft cloth and non-abrasive cleaner. The bottom of the base should be periodically inspected to ensure that the heat is being efficiently transferred away from the component or system.
The ATS-03F-92-C1-R0 is a reliable and efficient thermal-heat sink product. It is designed to transfer heat away from electronic components and systems. Its base is made of dielectric materials, while its fins are constructed from aluminum, copper or plastic. The device is easy to install and maintain, and can be used in a variety of applications, including electronic systems, automotive applications and industrial applications.
The specific data is subject to PDF, and the above content is for reference