ATS-03F-93-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.42°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal-heat sinks are a critical component of computers and electronic devices, as these sinks are used to keep components running at a cooler temperature, avoiding potential damage from overheating. The ATS-03F-93-C3-R0 heat sink is an effective solution that is suitable for applications such as telecommunications systems, audio-visual equipment, and medical and networking devices. In this article, we will discuss the application field and working principle of the ATS-03F-93-C3-R0 heat sink.

Application Field

The ATS-03F-93-C3-R0 heat sink is designed for use with high-power components in a wide variety of applications. These include communications systems, audio-visual equipment, medical and networking devices, and other electronic equipment that requires effective thermal dissipation. The ATS-03F-93-C3-R0 heat sink is designed to efficiently remove heat from components at an economical price.The ATS-03F-93-C3-R0 heat sink is designed with a space saving configuration, which makes it ideal for applications where mounting space is limited. The ATS-03F-93-C3-R0 heat sink is also designed to possess a wide range of heat dissipation capabilities, which makes it suitable for use with a variety of components that dissipate different amounts of heat.

Working Principle

The ATS-03F-93-C3-R0 heat sink works by transferring heat from the component to the aluminum fins of the heat sink. The aluminum fins are designed to increase the surface area, allowing heat to spread and dissipate more efficiently. The fins are also designed to be closely spaced, creating an area of low air resistance, which helps to dissipate the heat at a faster rate. The ATS-03F-93-C3-R0 heat sink is designed to be used with a fan, which helps to further increase heat dissipation capabilities, while also reducing the noise level. The fan is designed to draw air in from one side of the heat sink and exhaust it on the other side. This creates an airflow over the fins, which helps increase the rate at which heat is transferred and dissipated.The ATS-03F-93-C3-R0 heat sink is also designed to be highly efficient, as it utilizes advanced thermal technology and materials. This helps to ensure that heat is dissipated more efficiently, while also reducing noise levels.

Conclusion

The ATS-03F-93-C3-R0 heat sink is an efficient and economical solution for applications that require effective thermal dissipation. The ATS-03F-93-C3-R0 heat sink is designed for high-power components and is suitable for use in a variety of applications, including telecommunications systems, audio-visual equipment, medical and networking devices, and other electronic equipment. The ATS-03F-93-C3-R0 heat sink works by transferring heat from the component to the aluminum fins of the heat sink, and is designed to be used with a fan for increased heat dissipation and noise reduction. The ATS-03F-93-C3-R0 heat sink is highly efficient, utilizing advanced thermal technology and materials, to ensure effective thermal dissipation.

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