| Allicdata Part #: | ATS7001-ND |
| Manufacturer Part#: |
ATS-03G-05-C2-R0 |
| Price: | $ 3.95 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03G-05-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.59100 |
| 10 +: | $ 3.49524 |
| 25 +: | $ 3.40074 |
| 50 +: | $ 3.21174 |
| 100 +: | $ 3.02280 |
| 250 +: | $ 2.83387 |
| 500 +: | $ 2.73940 |
| 1000 +: | $ 2.45602 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.72°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important component of many electronic systems, and one of the most widely used thermal solutions is using heat sinks. Heat sinks are designed to dissipate heat away from system components by convecting the heat away from the components and into the surrounding air. The ATS-03G-05-C2-R0 is one such heat sink that is commonly used for thermal management.
The ATS-03G-05-C2-R0 heat sink is designed for efficient heat transfer, and it is made from aluminum material that is lightweight and durable. The heat sink features a two-screw mounting system that allows for easy installation. The heat sink can be used in a variety of applications, such as systems that produce a large amount of heat, as well as those that are in a confined space. Additionally, the heat sink is rated to handle up to four watts of power.
The ATS-03G-05-C2-R0 uses a pinned fin array design, which increases its ability to dissipate heat from the component. The heat is then dispersed into the surrounding air by natural convection. Natural convection occurs when the heat causes the air around the heat sink to rise, which in turn creates a cooling effect on the component by pulling cooler air across it. The fin array also increases the surface area that the heat can be transferred to.
In addition to its finned design, the ATS-03G-05-C2-R0 comes with a special thermal interface material that aids in transferring the heat from the component to the heat sink. The thermal interface material is designed to prevent air gaps between the heat sink and component, which can reduce the efficiency of heat transfer. It is also important to note that the thermal interface material should be checked periodically for any defects or deterioration, as this can also hinder the performance of the heat sink.
The ATS-03G-05-C2-R0 heat sink is an efficient temperature management solution, with its combination of light weight, durability, and heat dissipation. It is suitable for a variety of applications, from small consumer electronics to large industrial equipment, and it is easy to install and maintain. With its efficient design and durable construction, the ATS-03G-05-C2-R0 is an ideal choice for thermal management and heat dissipation.
The specific data is subject to PDF, and the above content is for reference