| Allicdata Part #: | ATS-03G-09-C1-R0-ND |
| Manufacturer Part#: |
ATS-03G-09-C1-R0 |
| Price: | $ 3.49 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03G-09-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.17394 |
| 30 +: | $ 3.08826 |
| 50 +: | $ 2.91677 |
| 100 +: | $ 2.74516 |
| 250 +: | $ 2.57363 |
| 500 +: | $ 2.48783 |
| 1000 +: | $ 2.23047 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.56°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management of electronic components is critical for ensuring consistent availability and performance. Heat sinks are one of the most effective methods of managing thermal energy. The ATS-03G-09-C1-R0 heat sink is a great option for cooling electronic components in limited spaces.
The ATS-03G-09-C1-R0 is a low-profile aluminum heat sink specifically designed to allow more airflow around electronic components. It features a small footprint and a high-density fin count, allowing for efficient thermal heat dissipation. The profile of the heat sink features two staggered fins, providing increased surface area for effective heat transfer. The precision-tooled extruded aluminum profile also features an open design for natural convection.
The ATS-03G-09-C1-R0 is ideal for cooling components in spaces with limited airflow. Its open design boosts the air\'s natural convection to effectively dissipate heat away from sensitive components. The heat sink also features an anodized finish, making it resistant to corrosion and abrasion.
The ATS-03G-09-C1-R0 heat sink works by dissipating thermal energy away from components. When heat is generated, it is transferred from the component to the heat sink, which then dissipates the heat into the surrounding environment. The increased surface area of the heat sink provides more contact points for the heat transfer, allowing for more efficient heat dissipation.
The ATS-03G-09-C1-R0 is suitable for a wide range of applications, including semiconductor cooling, power supply management, and audio equipment. It is lightweight, durable, and easy to install, making it a great choice for any thermal management application. The heat sink is also compatible with a wide range of electronic components, allowing for greater flexibility.
The ATS-03G-09-C1-R0 heat sink is a great option for cooling components in limited spaces. Its open design and staggered fins provide increased surface area, allowing for more efficient heat dissipation. The lightweight and durable design make it easy to install, and the anodized finish provides added protection against corrosion and abrasion. The ATS-03G-09-C1-R0 heat sink is suitable for a wide range of applications, making it a great choice for any thermal management needs.
The specific data is subject to PDF, and the above content is for reference