ATS-03G-10-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-03G-10-C1-R0-ND

Manufacturer Part#:

ATS-03G-10-C1-R0

Price: $ 3.61
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-03G-10-C1-R0 datasheetATS-03G-10-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.28104
30 +: $ 3.19242
50 +: $ 3.01505
100 +: $ 2.83771
250 +: $ 2.66036
500 +: $ 2.57169
1000 +: $ 2.30565
Stock 1000Can Ship Immediately
$ 3.61
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.87°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-03G-10-C1-R0 heat sink is a great choice for applications that require efficient thermal management. This slim, lightweight heat sink is one of the most popular in the market today, and its modular design allows users to customize the thermal resistance for their specific applications. This versatile heat sink is an excellent choice for high-performance components and provides maximum surface area with minimal footprint.

The ATS-03G-10-C1-R0 heat sink consists of a top plate and fin stack which are bonded and clamped together. The top plate is made of aluminum and is designed to allow for easy installation and thermal management. The fin stack consists of a thermal spreader, springs, a structural support plate, and several fins. The thermal spreader absorbs and dissipates heat, while the springs keep the structure secure by counteracting thermal expansion. The structural support plate helps to ensure that the fins are mounted securely and evenly.

The ATS-03G-10-C1-R0 heat sink is made using a process called die-casting, which helps to ensure that the fins have a consistent shape and thickness. The fins are also carefully designed to optimize the thermal resistance, so they can efficiently transfer heat away from the component. The heat sink also features an optimized air flow pattern to ensure maximum heat dissipation. Additionally, the heat sink has a unique floating clip design which allows it to be installed without supplemental fastening.

The ATS-03G-10-C1-R0 heat sink is a great choice for applications that require reliable and efficient thermal management. Its modular design provides users with the ability to customize the thermal resistance of the heat sink to meet the needs of their specific application. The heat sink also uses die-casting to ensure that the fins maintain an accurate shape and thickness, and its optimized air flow pattern allows for maximum heat dissipation. Furthermore, the heat sink\'s floating clip design allows for easy installation without the need for supplemental fastening.

The specific data is subject to PDF, and the above content is for reference

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