ATS-03G-131-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-03G-131-C1-R0-ND

Manufacturer Part#:

ATS-03G-131-C1-R0

Price: $ 4.16
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X20MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-03G-131-C1-R0 datasheetATS-03G-131-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.78252
30 +: $ 3.57231
50 +: $ 3.36206
100 +: $ 3.15195
250 +: $ 2.94182
500 +: $ 2.73169
1000 +: $ 2.67917
Stock 1000Can Ship Immediately
$ 4.16
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.58°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are a common component used in various electronic systems. The ATS-03G-131-C1-R0 is one such heat sink, and is used in a number of applications. It is typically used in areas where there is a need for efficient cooling, such as servers, computers, and other high-powered equipment. The ATS-03G-131-C1-R0 is specifically designed to provide an optimal amount of cooling, without compromising the efficiency and durability of the device.

The ATS-03G-131-C1-R0 heat sink consists of two main components, an aluminum fin heat sink and a copper base. The copper base serves as a surface on which the aluminum fins are attached. The base and fins are then covered by an insulating material, usually a polyimide die-cut gap filler. The gap filler serves two primary purposes. First, it provides a gap so that the air can freely flow through the device, and second, it helps to reduce the heat loss from the device.

The aluminum fin heat sink is designed to transfer heat away from the device and into the atmosphere. The fins reduce the heat of the device by reducing the surface area of contact between the device and the air. This reduced amount of contact prevents heat from being trapped and dissipated into the atmosphere. Heat is instead dissipated through the fins, which increases the amount of cooling efficiency.

The copper base of the ATS-03G-131-C1-R0 also serves several purposes. In addition to its heat transfer capabilities, the copper base also helps to reduce the impact of vibration on the device. Vibration can cause a decrease in the performance of the device, but the copper base acts as a damping mechanism, absorbing the vibrations and reducing their effect.

The ATS-03G-131-C1-R0 is typically used in applications that require efficient cooling solutions. This can be anything from computers to servers, as well as other high-powered equipment that needs to stay cool in order to remain efficient. The combination of the aluminum fin heat sink and copper base allows the device to remain efficient and provide cooling even under the most demanding conditions.

In addition to providing efficient cooling, the ATS-03G-131-C1-R0 also has a number of other features. The device is very lightweight and has a slim profile, making it easy to install in tight spaces. It also has an extended life cycle, due to the robust construction and insulation materials used in its manufacturing process. The device is also designed to be environmentally friendly, with the copper base containing no toxic substances.

The ATS-03G-131-C1-R0 can be used in a variety of applications, from cooling computers and servers to providing efficient cooling solutions to high-powered equipment. Its combination of aluminum fins and copper base make it an ideal heat sink for a number of different needs. It is a versatile, efficient, and reliable cooling solution, and it is well suited for any application where efficient cooling is needed.

The specific data is subject to PDF, and the above content is for reference

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