ATS-03G-134-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.756" (70.00mm)
Width:	2.756" (70.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.44°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks are essential components which are used to prevent components and circuit boards from overheating in a range of electronic equipment. The ATS-03G-134-C2-R0 Heat Sink is a particularly efficient device designed to protect and dissipate heat away from sensitive components. This application field and working principle can be discussed in greater detail as follows.

< p>The ATS-03G-134-C2-R0 Heat Sink has been designed to be used in many different types of electronic equipment, including computers, audio equipment, and television sets. The device is constructed from stainless steel and features a die-cast aluminum alloy base. This combination of materials provides superior thermal conductivity while also ensuring durability and an increased lifespan. Due to the high-performance design, the ATS-03G-134-C2-R0 is ideal for use in devices with limited space and demanding cooling requirements.

< p>The heat sink works by dissipating heat away from the enclosed components and circuit boards. Heat is generated as a result of electric current flowing through the components, and this heat needs to be managed in order to prevent the components from becoming damaged by overheating. The ATS-03G-134-C2-R0 Heat Sink is designed to draw the heat away from the components and disperse it into the surrounding environment. This is achieved through the heat sink’s metal fins, which are specially designed for maximum heat transfer properties.

< p>The ATS-03G-134-C2-R0 Heat Sink also features specialised grooves that are designed to help further increase the effectiveness of the heat dissipation process. These grooves provide additional surface area for the spread of heat, allowing for even more heat to be removed from the enclosed components and circuit boards. The grooves also allow the heat sink to be more easily mounted onto various surfaces, such as circuit boards, allowing for a more secure fit.

< p>The ATS-03G-134-C2-R0 Heat Sink is an effective device that can be used in a wide range of electronic equipment to protect those components and circuit boards from becoming damaged due to excess heat. The device features high-performance construction and design that help to ensure maximum heat dissipation from the enclosed components and circuit boards. The device is also easy to install, making it a cost-effective and reliable solution for dissipating heat away from sensitive components.

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