ATS-03G-147-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	13.48°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are one of the most common thermal management technologies used across a wide variety of industries. The application range extends from cooling off power modules to thermal storage and heat dissipation, and the various uses indicate a wide variety of functions that the Thermal - Heat Sinks can be used for.The ATS-03G-147-C1-R0, produced by Nidec Copal Electronics, is a small and lightweight thermal - heat sink specifically designed to dissipate heat in power supply modules, such as those used in overtemperature protection or short circuit protection. In this article, we will take a look at the various aspects of the ATS-03G-147-C1-R0, such as its application field, working principle, advantages, and disadvantages.

Application Field

The ATS-03G-147-C1-R0 is primarily used to dissipate heat in power modules. It is designed to operate with a wide range of single and multiple-row chip packages and other small form factor packages. It is ideal for use in high-density applications such as digital consumer electronics, computers, and telecommunications. It also has excellent corrosion resistance due to its aluminum alloy construction, making it well suited for use in moist or humid environments.The ATS-03G-147-C1-R0 offers a slim footprint and can be used in a wide range of applications. It can be used to dissipate heat in situations where the active and passive components of the circuit are separated. In addition, it can also be used in high-speed and high-frequency applications, as it is designed to dissipate heat quickly. It is also suitable for use in situations where space dominance is greater than air convection.

Working Principle

The ATS-03G-147-C1-R0 works by dissipating the heat collected from the power supply module into the air. It does this by absorbing the heat from the module through an upper and lower thermal interface layer, which then transfers the heat away from the module and into the air. The design of the ATS-03G-147-C1-R0 allows for a high thermal efficiency, due to the large surface area and its lightweight. This allows for an effective heat dissipation rate, which is critical for any heat sink.The ATS-03G-147-C1-R0 also incorporates a built-in fan for improved heat dissipation. The fan is mounted in the middle of the unit, which increases the airflow and reduces the overall operating temperature. The fan also helps to keep the temperature uniform throughout the thermal management system.

Advantages

The main advantage of using the ATS-03G-147-C1-R0 for thermal management is its compact size and lightweight. This is ideal for applications where space is at a premium, since it can be easily mounted and does not take up too much room. Additionally, it has a high thermal efficiency and is built to dissipate heat quickly.The ATS-03G-147-C1-R0 also offers a low installation cost, as it is designed to be easily installed and has a low maintenance requirement. This means that it is easy to integrate into existing systems, and requires minimal installation and maintenance. The ATS-03G-147-C1-R0 also has corrosion resistance, making it suitable for use in moist or humid conditions.

Disadvantages

The primary disadvantage of the ATS-03G-147-C1-R0 is that it is limited to dissipating the heat generated in power supply modules. This means that it is not suitable for dissipating heat from active components or in high-speed applications. Additionally, it is not designed to be used in applications where air convection is the only means of heat dissipation.

Conclusion

The ATS-03G-147-C1-R0 is a small and lightweight Thermal - Heat Sink designed specifically for the purpose of dissipating heat in power supply modules. It is ideal for use in high-density applications such as digital consumer electronics, computers, and telecommunications. It has a high thermal efficiency due to its large surface area and lightweight design, and it also has excellent corrosion resistance. The ATS-03G-147-C1-R0 is easy to install and has a low maintenance requirement, making it ideal for integrating into existing systems. However, it is limited to dissipating the heat generated in power supply modules and is not designed for use in high-speed applications.

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