| Allicdata Part #: | ATS7076-ND |
| Manufacturer Part#: |
ATS-03G-163-C2-R0 |
| Price: | $ 4.89 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X30MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03G-163-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.44780 |
| 10 +: | $ 4.32621 |
| 25 +: | $ 4.08568 |
| 50 +: | $ 3.84527 |
| 100 +: | $ 3.60499 |
| 250 +: | $ 3.36466 |
| 500 +: | $ 3.12432 |
| 1000 +: | $ 3.06424 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are designed to help disperse excessive heat away from a particular module or device, for example an ATS-03G-163-C2-R0. They are usually made up of several metal or plastic fins and their position is to draw away the heat generated during the operation of a device or module, thus preserving its functionality and possibly increasing its lifespan. Heat sinks are most commonly used in specialized application fields such as telecommunications, power systems and electronic systems.
The ATS-03G-163-C2-R0 is a heat sink designed to be used in medium sized modules and low power systems. It has an overall size of 63 mm x 31 mm x 24 mm, making it ideal for applications where space is at a premium. The ATS-03G-163-C2-R0 is made of cast aluminum which offers superior heat transfer and low thermal resistance. The heat sink also has a large fin area with high aspect ratio to maximize cooling capabilities.
The working principle of the ATS-03G-163-C2-R0 is based on two main factors. The first is the Thermal Conductivity of the heat sink material. Thermal Conductivity is a measure of how well a material transfers heat from hot to cold, and the higher the conductivity of the material the better it is at cooling. The second factor is Heat Dissipation, which is a measure of how quickly the heat is dispersed from the heat sink. Heat Dissipation is mainly determined by the size of the heat sink and the number of fins it has.
The ATS-03G-163-C2-R0 is suitable for a variety of applications due to its unique combination of thermal conductivity and efficient heat dissipation. It can be used in extreme environments such as those found in high performance computing, industrial, automotive, and military applications. It can also be applied in medical, consumer electronics, aerospace, and safe storage applications.
In summary, the ATS-03G-163-C2-R0 is a heat sink designed to dissipate excessive heat away from modules and other electronic devices. It is made of cast aluminum and has a large fin area with high aspect ratio to maximize cooling capabilities. It is suitable for a variety of applications due to its excellent thermal conductivity and efficient heat dissipation. With its superior performance and high levels of compatibility, the ATS-03G-163-C2-R0 is an excellent option for a range of thermal management solutions.
The specific data is subject to PDF, and the above content is for reference