| Allicdata Part #: | ATS7098-ND |
| Manufacturer Part#: |
ATS-03G-183-C2-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03G-183-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.92490 |
| 10 +: | $ 3.81717 |
| 25 +: | $ 3.60511 |
| 50 +: | $ 3.39293 |
| 100 +: | $ 3.18087 |
| 250 +: | $ 2.96881 |
| 500 +: | $ 2.75675 |
| 1000 +: | $ 2.70374 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.37°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks is a popular type of equipment used across a variety of industries. It is used to transfer heat from one location to another by transferring thermal energy through a thermal conductor or other solid surface. The ATS-03G-183-C2-R0 is a popular thermal transfer device used in a variety of applications.
The ATS-03G-183-C2-R0 is a finned heat sink that uses a combination of convection and conduction to transfer heat. It is composed of several different components, including a finned base, fins, and mounting clips. The finned base provides the main thermal surface area and allows air to pass over it. The fins are made of material that is thermally conductive and are designed to transfer heat away from the base and direct it to the environments around them. The mounting clips provide a secure mounting point for the thermal device and allow for easy installation and removal.
The ATS-03G-183-C2-R0 is typically used in applications where there is a need to transfer heat away from sensitive components. It is commonly used in data centers, manufacturing facilities, and other areas where electronic components need to be kept cool. The device helps to reduce the risk of overheating, which can lead to system failures and damage to sensitive components.
The ATS-03G-183-C2-R0 operates by exchanging thermal energy between the hot and cold areas of the environment. The device is designed to capture heat from the hot area and transfer it to the cooler portion of the environment. The fins help to direct the air flow, allowing for a more efficient transfer of heat. This type of thermal transfer device is often used with fans and other air flow devices, helping to ensure optimal thermal performance.
The ATS-03G-183-C2-R0 is a versatile device that can be used in a multitude of applications. It is often used to keep sensitive electronic components from overheating and is especially important in applications where components need to stay cool. It is an efficient solution for keeping components from reaching too high temperatures, and is an ideal choice for those looking for reliable and efficient thermal management.
The specific data is subject to PDF, and the above content is for reference