| Allicdata Part #: | ATS-03G-25-C1-R0-ND |
| Manufacturer Part#: |
ATS-03G-25-C1-R0 |
| Price: | $ 4.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03G-25-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.32621 |
| 30 +: | $ 4.08555 |
| 50 +: | $ 3.84527 |
| 100 +: | $ 3.60499 |
| 250 +: | $ 3.36466 |
| 500 +: | $ 3.12432 |
| 1000 +: | $ 3.06424 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.25°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal-Heat sinks are an essential part of electronics and computer systems. They are used to transfer heat away from components and dissipate it, allowing the components to function properly. The ATS-03G-25-C1-R0 is a highly reliable, cost-effective thermal-heat sink that can be used to help a wide variety of applications, including power systems, computing solutions, and more.
The ATS-03G-25-C1-R0 is a high quality thermal-heat sink designed to improve thermal performance and reliability. It is constructed from 20mm thick aluminum and features an innovative fin design to efficiently dissipate heat away from the component and into surrounding air. It offers excellent thermal-conductivity to ensure that components stay cool during operation and that overheating does not occur. It also features a unique spring-loaded mounting clip to provide secure attachment to the component.
One of the main advantages of the ATS-03G-25-C1-R0 is its high heat dissipation capacity. This means that the heat sink is able to transfer more heat away from the component, ensuring that the component does not overheat and that its operating temperature remains in an acceptable range. This also helps to extend the lifespan of the component by keeping it from becoming too hot too quickly.
The ATS-03G-25-C1-R0 is a great choice for a variety of applications, including medical electronics, industrial robotics and automation, and consumer electronics. As a result, it is a perfect choice for systems where thermal performance and reliability is essential. The high quality construction, efficient thermal performance, and a secure mounting clip make it a great choice for a wide range of applications.
The ATS-03G-25-C1-R0 is designed to work by transferring heat away from the component and into the surrounding air. Heat is transferred from the component and spread out in all directions, until it reaches the thermal-heat sink. The thermal-heat sink absorbs the heat and dissipates it into the surrounding air, allowing the component to cool down. This helps to keep the component\'s operating temperature in an acceptable range and can help to prolong its lifespan.
In conclusion, the ATS-03G-25-C1-R0 is a high quality, cost-effective thermal-heat sink that offers excellent thermal performance and reliability. It is suitable for a variety of applications, including medical electronics, industrial robotics and automation, and consumer electronics. The heat dissipation capacity is exceptional and it features a secure spring-loaded mounting clip for a secure fitting. The ATS-03G-25-C1-R0 is a great choice for ensuring that components stay cool during operation and that overheating is prevented.
The specific data is subject to PDF, and the above content is for reference