ATS-03G-33-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-03G-33-C1-R0-ND

Manufacturer Part#:

ATS-03G-33-C1-R0

Price: $ 5.41
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 57.9X36.83X17.78MM
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-03G-33-C1-R0 datasheetATS-03G-33-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.86990
30 +: $ 4.59900
50 +: $ 4.32860
100 +: $ 4.05802
250 +: $ 3.78748
500 +: $ 3.51695
1000 +: $ 3.44932
Stock 1000Can Ship Immediately
$ 5.41
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Width: 1.450" (36.83mm)
Diameter: --
Height Off Base (Height of Fin): 0.700" (17.78mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 17.40°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management solutions play a critical role in the operations of a wide range of electronic products. Heat sinks, for example, are necessary to dissipate unwanted heat that builds up in various applications. ATS-03G-33-C1-R0 is a heat sink from Advanced Thermal Solutions Inc., that provides efficient cooling for electronics and other components. In this article, we will discuss the application field and working principle of this device.

ATS-03G-33-C1-R0 is designed for use in a wide array of applications. These include power supply systems, automotive electronics, medical electronics, industrial control systems, power converters, and telecommunication infrastructure. The device provides cooling for devices that generate high levels of heat, ensuring proper functioning and subsequent longevity. As an added bonus, the heatsink is engineered to be aesthetically pleasing and suitable for public view areas.

Thermal conductivity and low thermal resistance are the two most important characteristics of the ATS-03G-33-C1-R0 heat sink. The device features an active cooling system that makes use of an aluminum (Al) heat sink base, a copper (Cu) heat spreader, and an extruded aluminum (Al) heatsink body. These components come together to form an efficient cooling system that dissipates heat effectively and efficiently.

Heat produced by an application is transferred from the device to the heatsink. This transfer occurs through a combination of conduction and convection, two mechanisms of heat transfer. The aluminum heat sink base features a fin design that helps to maximize heat dissipation. Copper heat spreader is also featured in the device which serves to conduct heat away from the components and dissipate it throughout the heatsink. The aluminum heatsink body also helps to spread the heat evenly throughout the entire device.

The design of the ATS-03G-33-C1-R0 heatsink also incorporates a fan that helps to accelerate the cooling process, as well as reduce the noise of the fan. The fan is powered by an external power source such as a 12V DC power supply, or via an internal power supply from the application itself. The fan works in conjunction with the aluminum heatsink to circulate cool air throughout the heatsink, and dissipate heat away from the components efficiently and quickly. The fan also helps to keep the ambient environment around the device cool, which helps to extend its lifespan.

In addition, ATS-03G-33-C1-R0 also comes with an air duct that helps to direct the airflow from the fan and increase its efficiency. The airflow from the fan is divided into two separate channels by the air duct, with one directed away from the application and the other towards the heatsink assembly. This helps to evenly distribute the cool air and improve the performance of the device.

In conclusion, the ATS-03G-33-C1-R0 heat sink is an efficient cooling solution for a variety of applications. The device features aluminum and copper components that conduct heat away from the application, and an onboard fan that circulates cool air around the device to help dissipate the heat. The design also helps to reduce noise from the fan and improve cooling efficiency. In summary, the ATS-03G-33-C1-R0 thermal management solution is an all-in-one solution for efficient and effective cooling, making it the perfect choice for any application.

The specific data is subject to PDF, and the above content is for reference

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