| Allicdata Part #: | ATS-03G-34-C3-R0-ND |
| Manufacturer Part#: |
ATS-03G-34-C3-R0 |
| Price: | $ 5.95 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X22.86MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03G-34-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.35563 |
| 30 +: | $ 5.05785 |
| 50 +: | $ 4.76041 |
| 100 +: | $ 4.46286 |
| 250 +: | $ 4.16534 |
| 500 +: | $ 3.86781 |
| 1000 +: | $ 3.79343 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.900" (22.86mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.40°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are used to disperse and manage heat from components within a system. The common purpose of a Thermal - Heat Sink is to reduce system temperatures, optimize component performance, and increase the durability and lifespan of the system. The ATS-03G-34-C3-R0 is an example of a Thermal - Heat Sink, designed to dissipate a significant amount of heat generated from applications such as computer processors, LCDs, game consoles, and other PCBs.
The ATS-03G-34-C3-R0 contains a thermal device with stainless steel and aluminum construction. It is designed with a fanless structure, providing users with a much quieter and cooler operation. The air-flow design of the device helps to naturally remove heat from the system while keeping vibrations to a minimum. Its design also increases the amount of direct contact and heat dissipation between the device and the component it is cooling. The device is able to provide efficient cooling to components by reaching a maximum temperature of 60 degrees Celsius.
The ATS-03G-34-C3-R0 provides a range of application fields, such as computers and peripherals, audio and video equipment, telecommunications equipment, consumer electronics, and gaming consoles. It can also be used for industrial equipment, LED lighting systems, medical equipment, and renewable energy systems. It is also a good choice for system monitoring, data analysis, and other applications that require high levels of performance and functionality.
The ATS-03G-34-C3-R0 operates on a simplified principle of thermodynamics and heat conduction. Heat is removed from the component and dissipated through the heat sink as air passes through the finned surfaces of the device. The fins act as conductors to transfer thermal energy to the surrounding air, dispersing the heat away from the system. The vents in the device help to create a more efficient flow of air, enabling it to keep its temperature low.
The ATS-03G-34-C3-R0 is an ideal choice for thermal management and cooling of components in a variety of applications and environments. Its fanless structure, air-flow design, and thermal capabilities provide users with the reliable cooling they need for their systems. The device is easy to install and its efficiency makes it a cost-effective solution for many applications.
The specific data is subject to PDF, and the above content is for reference