| Allicdata Part #: | ATS-03G-40-C1-R0-ND |
| Manufacturer Part#: |
ATS-03G-40-C1-R0 |
| Price: | $ 5.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X11.43MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03G-40-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.26302 |
| 30 +: | $ 4.97049 |
| 50 +: | $ 4.67813 |
| 100 +: | $ 4.38575 |
| 250 +: | $ 4.09336 |
| 500 +: | $ 3.80098 |
| 1000 +: | $ 3.72789 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.55°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-03G-40-C1-R0 Thermal-Heat Sink Application Field and Working Principle
Thermal-Heat Sink has become an integral part of many electronic components that require cooling or heat dissipating capabilities.
ATS-03G-40-C1-R0 Thermal-Heat Sink is a type of Thermal-Heat Sink thatutilizes a thermoelectric technology (TE) to provide additional cooling andfurther heat dissipation. TE technology creates a temperature gradient between two separate structures due to a DC voltage applied. While the electrical energy is being dissipated as heat on one side, the other side will become cooler in form of heat sink radiation.
Its application field mainly focuses on high-power semiconductors, low-power LED lights and illuminating equipment, automotive power electronics, telecommunication and military/aerospace systems.
How Does ATS-03G-40-C1-R0 Thermal-Heat Sink Work?
The working principle behind ATS-03G-40-C1-R0 Thermal-Heat Sink is thermal transfer. A low-voltage DC motordrives a series of individual thermoelectric modules. When these modules are energized, heat energy is transferred between two separate heat sinks.
Specifically, the heat energy generated from the object to be cooled, typically a device, is absorbed into the thermoelectricmoduleandconductedtounderneaththemodule,whereitispumpedoutthroughthesecondaryheat-sink.
At the same time, a cooling agent is pumped to the top of the module and released on the surface of the object to be cooled. As a result, the object is further cooled by efficient conduction of heat energy from its surface. This is why ATS-03G-40-C1-R0 Thermal-Heat Sink and other such devices are recommended for cooling or heat dissipating parts in tight spaces.
Key Advantages of ATS-03G-40-C1-R0Thermal-Heat Sink
Thermoelectric cooling systems provide many advantages over traditional passive cooling systems, including:
- High-efficiency:
- The efficiencies of thermoelectric cooling systems are usually higher than those of traditional passive cooling devices.
- Low-noise performance:
- The operation of thermoelectric cooling systems is much quieter than that of traditional passive cooling devices. This makes them ideal for applications where sound should not be an issue.
- Small size:
- The size of a thermoelectric cooling system is much smaller than that of traditional passive cooling devices due to the lack of bulky fans. Therefore, thermoelectric cooling systems can be used to cool and dissipate heat in tight spaces.
Conclusion
ATS-03G-40-C1-R0 Thermal-Heat Sink is a highly efficient and reliable thermal-heat sink with many advantages. It is suitable for usein high-power semiconductors, low-power LED lights and illuminating equipment, automotive power electronics, telecommunication and military/aerospace applications, and its small size makes it ideal for use in tight spaces.
The specific data is subject to PDF, and the above content is for reference