ATS-03G-63-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.32°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-03G-63-C2-R0 Heat Sink The ATS-03G-63-C2-R0 heat sink is a type of thermal management device that is commonly used in heat transfer applications. It is specifically designed to dissipate heat from electronic components and other systems. The ATS-03G-63-C2-R0 heat sink is highly efficient and extremely durable, making it a great choice for many types of applications.Application Field of ATS-03G-63-C2-R0 Heat Sink The ATS-03G-63-C2-R0 heat sink is used in many different applications. It can be used in industrial, military, medical, automotive, and consumer electronics. This heat sink is ideal for applications requiring efficient heat transfer and thermal management. It can be used in CPU, GPU, and other types of components that require reliable cooling.The ATS-03G-63-C2-R0 heat sink is also ideal for use in environments where space is at a premium. It is lightweight, slim, and highly dependable. Its small size makes it perfect for use in laptops, PCs, and other portable devices. Additionally, its slim design allows for easy installation in tight spaces.Working Principle of ATS-03G-63-C2-R0 Heat Sink Heat management is critical for any electronic components or systems, and the ATS-03G-63-C2-R0 heat sink is designed to efficiently handle this task. This heat sink works on the principle of convection. It uses a combination of a fan and a finned surface to transfer heat away from the component it is attached to. The cooling fan pulls in air, which flows over the finned surface and dissipates heat.The ATS-03G-63-C2-R0 heat sink features a highly efficient design that allows it to dissipate heat quickly and reliably. The heat sink\'s fins are designed to maximize surface area, which helps to reduce the overall thermal resistance. The fan also moves air over the fins at an optimal rate to ensure that the heat is efficiently transferred away from the components. The fan can also be adjusted to varying speeds to further help with cooling efficiency.Features of ATS-03G-63-C2-R0 Heat Sink The ATS-03G-63-C2-R0 heat sink is designed to be reliable and efficient. It features a highly durable aluminum alloy construction that ensures longevity and reliability. Additionally, it is designed for easy installation and can be mounted on any flat surface using standard mounting hardware.The ATS-03G-63-C2-R0 heat sink also features a low-noise design. The fan is designed to move air efficiently and quietly, which helps it to be used in a variety of applications. Additionally, it has a compact form factor, which makes it easy to install in tight spaces.Conclusion The ATS-03G-63-C2-R0 heat sink is a highly efficient and durable thermal management device. Its efficient design and lightweight construction make it perfect for applications where space is at a premium. Additionally, its low-noise design and easy installation make it ideal for use in a variety of applications. It is a reliable and dependable choice for any thermal management task.

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