| Allicdata Part #: | ATS-03G-65-C1-R0-ND |
| Manufacturer Part#: |
ATS-03G-65-C1-R0 |
| Price: | $ 4.02 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-03G-65-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.65526 |
| 30 +: | $ 3.45198 |
| 50 +: | $ 3.24904 |
| 100 +: | $ 3.04592 |
| 250 +: | $ 2.84286 |
| 500 +: | $ 2.63980 |
| 1000 +: | $ 2.58903 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.27°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-03G-65-C1-R0 is a widely-used heat sink designed for effective thermal management. It is an efficient solution in dissipating and dissipating the heat generated by a wide variety of high-power electronics devices. This heat sink is equipped with a variety of features that allow it to provide optimal thermal performance for even the most demanding applications.
The ATS-03G-65-C1-R0 utilizes proprietary technology to create an efficient thermal management package. Its aluminum body is designed to draw heat away from electronic components quickly and effectively. It features a variety of fins which allow for increased surface area, resulting in faster heat dissipation. The fins also serve as natural air-flow guides, which helps to cool down the heat sink.
The ATS-03G-65-C1-R0 also utilizes a range of technology that helps to protect electronic components. Its body is designed to resist corrosion and oxidation to ensure that the heat sink can be used in extreme conditions. Additionally, the heat sink is thermally conductive enough that it can be used in applications that require extra heat dissipation.
The ATS-03G-65-C1-R0 is an ideal solution for a variety of thermal management applications. The heat sink is able to dissipate heat generated by high power-electronics devices such as lasers, microchips, and circuit boards. Additionally, the heat is effective in regulating temperatures for micro-controllers, servers, and other small-scale electronic components. This makes the heat sink an ideal choice for a variety of industries, including automotive, medical, and industrial applications.
The ATS-03G-65-C1-R0 works by drawing heat away from electronics components and dispersing the heat in several different ways. The fins on the heat sink act as natural air-flow guides, which helps to cool down the heat sink faster. Additionally, the heat sink is designed to be thermally conductive, allowing for fast heat dissipation even in relatively high temperatures. The aluminium body of the heat sink also helps to effectively dissipate heat by acting as a thermal barrier, keeping temperatures down.
The ATS-03G-65-C1-R0 is an efficient and reliable thermal management solution. It is designed to provide optimal thermal performance in a wide range of applications, making it a preferred choice for heat sinks. Its features make it ideal for dissipating the large amounts of heat generated by high-power electronics devices. In addition, the heat sink is thermally conductive to ensure efficient heat dissipation even in high temperatures. Its aluminium body helps to resist corrosion and oxidation, making it a reliable and long-lasting solution for any type of application. As such, the ATS-03G-65-C1-R0 is a great choice for a wide variety of thermal management applications.
The specific data is subject to PDF, and the above content is for reference