ATS-03H-04-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS7198-ND

Manufacturer Part#:

ATS-03H-04-C2-R0

Price: $ 3.89
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X20MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-03H-04-C2-R0 datasheetATS-03H-04-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.50280
10 +: $ 3.41208
25 +: $ 3.31960
50 +: $ 3.13526
100 +: $ 2.95079
250 +: $ 2.76641
500 +: $ 2.67419
1000 +: $ 2.39754
Stock 1000Can Ship Immediately
$ 3.89
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.58°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-03H-04-C2-R0 is a heat sink designed to radiate large amounts of thermal energy that is generated within a circuit. The application field of this heat sink includes industrial, commercial, medical, automotive, and military applications. This type of heat sink is used to cool components and dissipate the heat generated from them, ensuring the working environment stays safe and free from hazardous levels of thermal energy.

The ATS-03H-04-C2-R0 works by using a combination of convection and radiation methods to dissipate the heat. The fins on the heat sink add surface area which improves the heat dissipation rate. A fan can be used to augment these methods by providing additional air flow which further improves its effectiveness.

The convection method of dissipating the thermal energy involves the heat sink being placed in an environment that has natural convection currents. This can be achieved by ensuring that the heat sink is placed away from any obstructions. This ensures that the air can move around the heat sink freely and carry away the thermal energy. The fins on the heat sink act as additional surface area which improves the heat dissipation rate by increasing the contact area of the heat sink with the environment.

The radiation method of dissipating the thermal energy involves using the heat sink as a thermally conductive material. The heat generated within the circuit is conducted away from the component and radiated away from the heat sink. The fins on the ATS-03H-04-C2-R0 heat sink act as additional surface area which enables the radiated heat to dissipate faster.

The ATS-03H-04-C2-R0 is an ideal heat sink for controlling large amounts of thermal energy in a wide range of applications. It can be used to dissipate the heat generated in a variety of environments including industrial, commercial, medical, automotive, and military. Its combination of convection and radiation methods ensures that the heat generated within the circuit is quickly and safely dissipated away from the components.

The specific data is subject to PDF, and the above content is for reference

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