![ATS-03H-117-C1-R0 Allicdata Electronics](https://files.allicdata.com/upload/common/default.jpg)
Allicdata Part #: | ATS-03H-117-C1-R0-ND |
Manufacturer Part#: |
ATS-03H-117-C1-R0 |
Price: | $ 3.09 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 45X45X10MM XCUT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 2.78208 |
30 +: | $ 2.70669 |
50 +: | $ 2.55629 |
100 +: | $ 2.40591 |
250 +: | $ 2.25553 |
500 +: | $ 2.18034 |
1000 +: | $ 1.95479 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.772" (45.00mm) |
Width: | 1.772" (45.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are thermal management solutions designed to dissipate heat from electronic components, maintain efficient temperature levels, and optimize the life of the assembly. The ATS-03H-117-C1-R0 heat sink is specifically designed to easily and quickly move heat away from components that have to function optimally in the most challenging applications. With its large thermal mass, this heat sink is able to effectively move heat away from components quickly and easily and improve their overall performance in any situation.
The ATS-03H-117-C1-R0 is built with high-performance material that is able to dissipate heat quickly. These materials possess excellent thermal conductivity, low weight, and high strength. Additionally, the design of the heat sink includes a highly efficient shape that maximizes the surface area to increase heat dissipation. This design allows for the rapid removal of heat from components, improving their performance in any application.
In order to ensure optimal performance in any application, the heat sink’s shape and material are chosen to best fit the needs of the application. This ensures that the heat sink design is the most efficient and effective for any specific situation. The ATS-03H-117-C1-R0 has a specially designed profile that not only increases heat dissipation but also provides superior mechanical integrity, with an ideal style for a variety of applications.
To ensure the heat sink’s effectiveness in any application, a thermal control system is used to monitor the heat sink’s performance. This system detects any power fluctuations or thermal issues that can shorten the life of any components. This system also helps to ensure that the heat sink’s design is being optimized and is performing to its maximum potential.
The ATS-03H-117-C1-R0 is designed to be used in the most challenging applications requiring the highest performance heat sinks need for maximum thermal efficiency and management. This thermal management solution is easy to install and provides excellent heat dissipation in its designed field. Coming in various standard shapes and sizes, this heat sink is ideal for applications that require maximum thermal performance and is compatible with many components.
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