
Allicdata Part #: | ATS-03H-124-C3-R0-ND |
Manufacturer Part#: |
ATS-03H-124-C3-R0 |
Price: | $ 3.94 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 50X50X25MM XCUT T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.58596 |
30 +: | $ 3.38646 |
50 +: | $ 3.18730 |
100 +: | $ 2.98809 |
250 +: | $ 2.78888 |
500 +: | $ 2.58968 |
1000 +: | $ 2.53987 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.969" (50.00mm) |
Width: | 1.969" (50.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 3.25°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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The thermal management component ATS-03H-124-C3-R0 is a type of heat sink that is used to reduce the temperature of electronic components and protect them from damage caused by excess heat. It consists of a metal fin stack, which is connected to a heat source like a CPU, with an attached thermal pad and a fan.
The metal fin stack is designed to act as a heat sink, which increases the surface area of the component and helps dissipate heat away from the component, thus reducing its temperature. Thermal paste is also used to ensure a better and more secure connection between the component and the heat sink. The fan helps to cool the component by drawing additional airflow through the metal fin stack.
The ATS-03H-124-C3-R0 is designed to work best in high-powered and high-performance components like graphics processors, CPUs, RAM, etc. that may require extra cooling. It is a reliable and efficient way to cool any electronic component and ensure its stability and longevity.
It is also a good choice for areas or components that are limited on space, due to its tall and thin design. It is also easy to install and requires minimal maintenance, which helps reduce operational costs. Additionally, due to its robust and solid design, it can handle high temperatures and strong pressure, making it suitable for most conditions and environments.
When it comes to its application, the ATS-03H-124-C3-R0 is suitable for many different uses. It can be used in desktop computers, gaming consoles, laptops, tablets, servers, industrial production processes, and many more. It is also a great choice for those who need a reliable and cost-effective cooling solution.
In conclusion, the ATS-03H-124-C3-R0 is a reliable, efficient and space-saving thermal management component that works great for any high-powered and high-performance electronic devices. It provides maximum heat dissipation, requires minimal maintenance and can handle high temperatures and strong pressure, making it the ideal choice for many applications.
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